Abstract: A mounting apparatus to mount a CPU (53) to a socket (52) includes a base (20), a fixing member (50), a pair of clipping members (30), a pair of operation members (40) and a pair of resilient members (80). The base defines a concave (26) adapted to accommodate the CPU therein. The fixing member is arranged on a top of the base. Each clipping member includes a rotatable portion (313) respectively pivotably mounted to two opposite sides of a lower portion of the fixing member. Each clipping member includes a fixing portion (31) and a clipping portion (32) located at opposite sides of the rotatable portion respectively. A hook (322) extends downwardly from the clipping portion for hooking the CPU. The operation members are mounted to the fixing portions of the fixing member. Each of the resilient members is located between the fixing member and a corresponding operation member.

Abstract: A mounting apparatus for mounting a CPU (53) in a socket (52), includes a base (20), a plurality of resilient members (300) respectively disposed at opposite sides of the base and a movement unit (40) having a pressing portion (402) received in the base which moves vertically with respect to the base. The base includes a concave (201) defined in a bottom thereof for receiving the CPU therein. The resilient members cooperate with each other to locate the CPU within the base. The pressing portion is provided to push the CPU off the base so as to vertically mount the CPU into the socket. The base includes projection portions (221, 233) to be received in slots (521, 523) in the socket.

Abstract: A mounting apparatus to mount a CPU (53) to a socket (52) includes a base (20), a fixing member (50), a pair of clipping members (30), a pair of operation members (40) and a pair of resilient members (80). The base defines a concave (26) adapted to accommodate the CPU therein. The fixing member is arranged on a top of the base. Each clipping member includes a rotatable portion (313) respectively pivotably mounted to two opposite sides of a lower portion of the fixing member. Each clipping member includes a fixing portion (31) and a clipping portion (32) located at opposite sides of the rotatable portion respectively. A hook (322) extends downwardly from the clipping portion for hooking the CPU. The operation members are mounted to the fixing portions of the fixing member. Each of the resilient members is located between the fixing member and a corresponding operation member.

Abstract: A mounting apparatus for mounting a CPU to a socket includes a connecting member (10) with a first air vent (16) defined therein, a pipe member (20) with a second air vent (26) defined therein, and a base (30) with a third air vent (32) defined therein. An end of the connecting member connects with a vacuum pump (13). The other end of the connecting member connects with an end of the pipe member. The other end of the pipe member connects with the base. A through hole (22) is defined in the pipe member. The base defines a concave (35) therein to accommodate the CPU therein. The concave communicates with the third air vent. The first air vent, the second air vent and the third air vent communicate with or are separated from the atmosphere through the through hole.

Abstract: A mounting apparatus for mounting a CPU (53) in a socket (52), includes a base (20), a plurality of resilient members (300) respectively disposed at opposite sides of the base and a movement unit (40) having a pressing portion (402) received in the base which moves vertically with respect to the base. The base includes a concave (201) defined in a bottom thereof for receiving the CPU therein. The resilient members cooperate with each other to locate the CPU within the base. The pressing portion is provided to push the CPU off the base so as to vertically mount the CPU into the socket.

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.

Abstract: A cleaning machine for cleaning supporting trays includes a cleaning cistern (100), a drying cabinet (200) and a control device (300). A water-supply pipe (112) and a drainpipe (120) are connected to the cleaning cistern. A microwave oven (118) is positioned in the cleaning cistern and a shelf (116) is located above the microwave oven for supporting the supporting trays. A cover (130) is pivotally attached to the cleaning cistern, under which a sensor is installed for sensing a level of water. The drying cabinet includes a shield (210) with a plurality of vents defined therein, and an intake fan (220) is provided in the shield. A plurality of heaters (232) is arranged in the drying cabinet below. One or more shelves (236) are mounted in the drying cabinet. An exhaust device (237) is connected to a back panel of the drying cabinet.

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.