Abstract: A cooking utensil according to the present invention includes a cooking utensil body A which is composed of a laminate including a metal substrate 1 and a fluorine resin film 2 laminated on the metal substrate 1, and the fluorine resin film 2 forms an inner surface of the cooking utensil body A, wherein the fluorine resin film 2 has a thickness 20 to 300 ?m, a thickness deviation of 0.1 to 10 ?m, and a surface roughness of 0.1 to 10 ?m. The fluorine resin film 2 is manufactured by a casting method, a cutting method, a calender method, or an extrusion molding method, thereby having uniform thickness and surface roughness. The fluorine resin film 2 has the uniform thickness and surface roughness, thereby improving non-stick characteristics.

Abstract: A breadmaking tray includes a breadmaking tray body B in which: (i) a fluorine resin film 2 having a thickness of 75 to 500 ?m is laminated on a metal substrate 1 through heat bonding; (ii) a plurality of holes h are punched; and (iii) an appearance thereof has a plate shape bent in a corrugated form, and the breadmaking tray can further include a frame A for supporting the body B. A method for manufacturing the breadmaking tray is provided. The breadmaking tray has excellent release properties since flour dough comes into contact with only the inner walls of holes h punched in the fluorine resin film having excellent release properties during a breadmaking process, without coming into contact with the inner walls of holes h punched in the metal substrate.

Abstract: Disclosed is a message conversion apparatus for integrated monitoring of industrial equipment capable of integrated management and monitoring using the internet or computer networks, by extracting data conforming to a predetermined Self Description from each message of different communication protocols and converting it into XML message format, when transmitting status and operational message from semiconductor equipment or industrial automation PLC equipment to a server.

Abstract: An interface device for semiconductor equipment which converts messages of semiconductor equipment received and transmitted via different protocols to integral XML (extensible Markup Language) message format, and the monitoring system using same is capable of distributed or integral message monitoring of the semiconductor equipment. The monitoring system comprising an interface device for semiconductor equipment capable of converting messages of semiconductor equipment received and transmitted via different protocols to integral XML message format, and classifying the message converted to XML format based on message characteristic.