Patents by Inventor Yong Namkung

Yong Namkung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11652196
    Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myunghee Kim, Donghwan Kim, Sungwook Kim, Yong Namkung, Jenghun Suh, Jaephil Shim
  • Patent number: 11515294
    Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: November 29, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ohjae Kwon, Jinmo Kang, Donghwan Kim, Yong Namkung, Seondeok Hwang
  • Publication number: 20220238503
    Abstract: A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.
    Type: Application
    Filed: April 18, 2022
    Publication date: July 28, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myunghee KIM, Youngki JUNG, Donghwan KIM, Yong NAMKUNG, Chulgyu JUNG
  • Publication number: 20210111325
    Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.
    Type: Application
    Filed: September 18, 2020
    Publication date: April 15, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myunghee KIM, Donghwan Kim, Sungwook Kim, Yong Namkung, Jenghun Suh, Jaephil Shim
  • Publication number: 20210013184
    Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.
    Type: Application
    Filed: June 3, 2020
    Publication date: January 14, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ohjae KWON, Jinmo Kang, Donghwan Kim, Yong Namkung, Seondeok Hwang