Abstract: A method for protecting a flat display panel in which a resin film with adhesive agent is attached to a color filter glass substrate or an encapsulation glass of the flat display panel and the resin film attached fiat display panel is cut into a plurality of cells to protect the flat display panel during a following manufacturing processes is provided.

Abstract: A method for protecting a flat display panel in which a resin film with adhesive agent is attached to a color filter glass substrate or an encapsulation glass of the flat display panel and the resin film attached flat display panel is cut into a plurality of cells to protect the flat display panel during a following manufacturing processes is provided.

Abstract: The present invention provides configuration of a flat display panel with a touch screen panel loaded thereon and a manufacturing method thereof. According to the present invention, a configuration of a flat display panel with a touch screen panel loaded thereon in which reduced number of sheets of glass substrate or resin film substrate is provided. The configuration includes a transparent electrode integrated encapsulation module in which the transparent electrode is formed on one surface of an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit. A method for manufacturing a transparent electrode integrated encapsulation module is provided.

Abstract: A configuration of a flat display panel with a touch screen panel loaded thereon in which reduced number of sheets of glass substrate or resin film substrate is provided. The configuration includes a transparent electrode integrated encapsulation module in which the transparent electrode is formed on one surface of an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit. A method for manufacturing the transparent electrode integrated encapsulation module is provided.

Abstract: A method for protecting a flat display panel in which a resin film with adhesive agent is attached to a color filter glass substrate or an encapsulation glass of the flat display panel and the resin film attached flat display panel is cut into a plurality of cells to protect the flat display panel during a following manufacturing processes is provided.

Abstract: A method for forming a device isolation film of a semiconductor device, which includes the steps of forming a pad oxide film on a semiconductor substrate, forming an oxidation buffer layer on the pad oxide film, forming an oxidation prevention film on the oxidation buffer layer, forming an aperture in the oxidation prevention film and a longitudinally co-extensive recess in the oxidation buffer layer, to thereby expose a portion of the oxidation buffer layer, forming a cap oxide film on the exposed portion of the oxidation buffer layer by subjecting a first resultant structure obtained by the preceding steps to a thermal oxidation process, forming an oxynitride film at an interface between the cap oxide film and the oxidation buffer layer by heat-treating a second resultant structure obtained by the preceding steps in a nitrogen atmosphere, and, forming the device isolation film by subjecting a third resultant structure obtained by the preceding steps to a thermal oxidation process.