Abstract: The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of conductive pads which are mutually insulated and close front-side ends of the through holes; a plurality of through-hole solder pads and a plurality of conductive traces arranged on the rear side of the substrate, wherein the through-hole solder pads are arranged at rear-side ends of the through holes, wherein the conductive traces are conductively coupled to the through-hole solder pads respectively; and a solder mask at least partially overlaying the conductive traces.

Abstract: An LAA-based wireless transmission access method is disclosed including: acquiring, by a BBU, a signal format corresponding to an LBT startup indication, and delivering a corresponding LBT startup indication message; distributing, by a bridge unit, the startup indication message to an RRU; performing, by the RRU, spectrum scanning according to the signal format to obtain idle/busy state information of an unlicensed spectrum in the signal format, and reporting the same to the BBU via the bridge unit; determining, by the BBU, a preemptable unlicensed spectrum in the signal format according to the idle/busy state information, and delivering an occupancy message; delivering, by the bridge unit, the occupancy message to the RRU; determining, by the RRU, a signal source of the signal format in the occupancy message; if the signal source is a different manufacturer, switching to an intermediate radio frequency processing channel of a different manufacturer for transmission.

Abstract: An online fast processing method for real-time data based on edge computing. In the method, a dynamic online de-noising method is adopted to remove noise contained in speeds to ensure the effectiveness and accuracy of de-noising results; for the displacement integrated online, an efficient method is adopted for dynamic online de-noising to further reduce the effectiveness of drift in the displacement value on final integration results; and under the condition of ensuring the accuracy of an integration method, an integration algorithm is embedded into an edge device to realize fast calculation and analysis of data near a data source and realize dynamic fast integration of online signals based on the edge device, which provides effective references for efficient processing and calculation of data.

Abstract: The present disclosure provides systems and methods for magnetic resonance imaging using a radio frequency coil, such as, for example, an intracranial radio frequency coil. In at least one aspect, a system can include a surgical tool and a magnetic resonance imaging system. The surgical tool can include a distal end portion and a radio frequency reception coil attached to the distal end portion. The magnetic resonance imaging system can be configured to project a magnetic field within a field of view and intraoperatively image the radio frequency reception coil in the field of view.

Abstract: The present disclosure relates to a smart card device comprising: a laminated core comprising: a front substrate (10); a first flexible sheet (20) having a card circuitry formed thereon; a first substrate (30); a second flexible sheet (40) having an inductive circuitry formed thereon, and a second substrate (50) in a top-to-bottom order, wherein the front substrate (10) provides at least one first opening (11) which defines a perforated design and a second opening (12) through which a contact pad (22) is exposed, wherein the card circuitry includes: a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), the contact pad (22), at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip (21), wherein the inductive circuitry includes at least one LED module (46) arranged proximate to the at least one first opening (11) and a second antenna coil (44) conductively coupled to the at least one LED module (46), and wherein the first substrate (30) inclu

Abstract: The present disclosure relates to a smart card device comprising: a laminated core comprising: a front substrate (10); a first flexible sheet (20) having a card circuitry formed thereon; a first substrate (30); a second flexible sheet (40) having an inductive circuitry formed thereon, and a second substrate (50) in a top-to-bottom order, wherein the front substrate (10) provides at least one first opening (11) which defines a perforated design and a second opening (12) through which a contact pad (22) is exposed, wherein the card circuitry includes: a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), the contact pad (22), at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip (21), wherein the inductive circuitry includes at least one LED module (46) arranged proximate to the at least one first opening (11) and a second antenna coil (44) conductively coupled to the at least one LED module (46), and wherein the first substrate (30) inclu

Abstract: The present invention belongs to the technical field of signal processing, and relates to an online fast processing method for real-time data based on edge computing. In the present invention, a dynamic online de-noising method is adopted to remove noise contained in speeds to ensure the effectiveness and accuracy of de-noising results; for the displacement integrated online, an efficient method is adopted for dynamic online de-noising to further reduce the effectiveness of drift in the displacement value on final integration results; and under the condition of ensuring the accuracy of an integration method, an integration algorithm is embedded into an edge device to realize fast calculation and analysis of data near a data source and realize dynamic fast integration of online signals based on edge computing, which provides effective references for efficient processing and calculation of data.

Abstract: An LAA-based wireless transmission access method is disclosed including: acquiring, by a BBU, a signal format corresponding to an LBT startup indication, and delivering a corresponding LBT startup indication message; distributing, by a bridge unit, the startup indication message to an RRU; performing, by the RRU, spectrum scanning according to the signal format to obtain idle/busy state information of an unlicensed spectrum in the signal format, and reporting the same to the BBU via the bridge unit; determining, by the BBU, a preemptable unlicensed spectrum in the signal format according to the idle/busy state information, and delivering an occupancy message; delivering, by the bridge unit, the occupancy message to the RRU; determining, by the RRU, a signal source of the signal format in the occupancy message; if the signal source is a different manufacturer, switching to an intermediate radio frequency processing channel of a different manufacturer for transmission.

Abstract: Embodiments of the invention relate to processes for fabricating a smart device, e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers interposing a flexible film having conductor pattern thereon, at least one flip chip for operating the smart card device is embedded in a first substrate such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip is arranged at a position in a first vertical plane; and a contact pad, for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.

Abstract: Embodiments of the invention relate to processes for fabricating a smart device, e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers interposing a flexible film having conductor pattern thereon, at least one flip chip for operating the smart card device is embedded in a first substrate such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip is arranged at a position in a first vertical plane; and a contact pad, for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.

Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.

Abstract: Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.

Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.

Abstract: Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.