Patents by Inventor Yong PANG
Yong PANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979914Abstract: A random access method includes working, by a user equipment (UE), on a first bandwidth part (BWP), where the first BWP is a currently active BWP, when the UE needs to perform a random access procedure, the UE performs the random access procedure on an initial BWP or on the first BWP, and when the UE receives BWP switching indication information from a network device instructing the UE to use a second BWP when performing the random access procedure on the first BWP, continuing, by the UE, to perform the random access procedure on the first BWP, or stopping, by the UE, performing the random access procedure on the first BWP, and performing the random access procedure on the second BWP.Type: GrantFiled: April 1, 2022Date of Patent: May 7, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Gaokun Pang, Qiang Fan, Ping Fang, Yong Cheng, Xiaoxian Li, Chong Lou, Qufang Huang, Qinghai Zeng, Yinghao Guo
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Publication number: 20240145432Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.Type: ApplicationFiled: March 1, 2022Publication date: May 2, 2024Inventors: Mengzhi Pang, Yang Sun, Yong guo Li, Jianjun Li, Rodrigo Rodriguez Navarrete, Vijaykumar Krithivasan, Rishabh Bhandari
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Publication number: 20240125743Abstract: A method for determining tobacco-specific nitrosamines (TSNAs) in cigarette smoke using one-step clean-up coupled with LC-MS/MS is provided, including the following steps: collecting a particulate matter of mainstream cigarette smoke with a Cambridge filter pad, mixing the particulate matter of mainstream cigarette smoke, an internal standards solution and water in a 50 mL plastic centrifuge tube, and vortexing the resulting mixture at room temperature to allow extraction; transferring an extraction solution after filtration to a new centrifuge tube, adding dichloromethane, and vortexing the resulting mixture; centrifuging to collect a dichloromethane extraction solution in a lower layer to another centrifuge tube, and placing the centrifuge tube in a water bath to remove dichloromethane; dissolving the resulting extraction solution in water, and transferring the resulting solution to an autosampler vial for LC-MS/MS analysis.Type: ApplicationFiled: November 20, 2023Publication date: April 18, 2024Applicant: Yunnan Academy Of Tobacco Agricultural SciencesInventors: Yong LI, Tao PANG, Junli SHI, Zhongbang SONG, Ge BAI, He XIE, Xingxiang WU, Niannian HU, Suxing TUO, Yunhui DAI
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Patent number: 11942053Abstract: Disclosed are a display panel and a driving method therefor, and a display device. Two adjacent rows of sub-pixels are taken as a row group, and the row group is provided with a first sub row group and a second sub row group that are arranged in a column direction; a gate electrode of a first transistor in the first sub row group is electrically connected to a first gate line; a gate electrode of a second transistor in the second sub row group is electrically connected to a second gate line; two adjacent sub-pixels in the column direction share one third transistor, and a gate electrode of the third transistor in the row group is electrically connected to a third gate line; and the first transistor and the second transistor in one column of sub-pixels are electrically connected to a data line by means of the shared third transistor.Type: GrantFiled: February 20, 2020Date of Patent: March 26, 2024Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Xianglei Qin, Jian Lin, Yong Zhang, Limin Zhang, Zepeng Sun, Zhichao Yang, Liangzhen Tang, Zhilong Duan, Honggui Jin, Yashuai An, Lingfang Nie, Jian Wang, Li Tian, Jing Pang, Xuechao Song
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Publication number: 20240085385Abstract: A method for determining tobacco-specific nitrosamines (TSNAs) in tobacco using one-step clean-up coupled with liquid chromatography-tandem mass spectrometry (LC-MS/MS) is provided, including the following steps: destemming flue-cured tobacco or sun-cured tobacco, drying, milling, and passing through a sieve; mixing the resulting tobacco, an internal standards solution and water in a plastic centrifuge tube, and vortexing the resulting mixture at room temperature to allow extraction; transferring an extraction solution after filtration to a new centrifuge tube, adding dichloromethane, and vortexing the resulting mixture; centrifuging to collect a dichloromethane extraction solution in a lower layer to another centrifuge tube, and placing the centrifuge tube in a water bath to remove dichloromethane; dissolving the resulting extraction solution in water, and transferring the resulting solution to an autosampler vial for LC-MS/MS analysis.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Yunnan Academy Of Tobacco Agricultural SciencesInventors: Yong LI, Tao PANG, Junli SHI, Zhongbang SONG, Ge BAI, He XIE, Xingxiang WU, Niannian HU, Suxing TUO, Yunhui DAI
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Patent number: 11919453Abstract: The present disclosure provides a vehicle positioning device for vehicle vision calibration, a positioning adjustment method, and a positioning adjustment system. The vehicle positioning device includes a base, a chassis, a translation mechanism and a rotation mechanism. A to-be-calibrated vehicle is placed onto the chassis, and the chassis is provided with a stopper. The translation mechanism is arranged between the chassis and the base, and configured to drive the chassis to move in an X-axis direction in a three-dimensional coordinate system relative to the base in accordance with a translation control instruction. The rotation mechanism is arranged between the chassis and the base, and configured to drive the chassis to rotate about a Z-axis in the three-dimensional coordinate system relative to the base in accordance with a rotation control instruction.Type: GrantFiled: February 16, 2021Date of Patent: March 5, 2024Assignee: Beijing Smarter Eye Technology Co. Ltd.Inventors: Ran Meng, Hua Chai, Yanqiu Xia, Zunying Pang, Zhe Wang, Yong Jia, Hui Cai, Chuanbin Feng
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Patent number: 11797817Abstract: The present disclosure relates to a smart card device comprising: a laminated core comprising: a front substrate (10); a first flexible sheet (20) having a card circuitry formed thereon; a first substrate (30); a second flexible sheet (40) having an inductive circuitry formed thereon, and a second substrate (50) in a top-to-bottom order, wherein the front substrate (10) provides at least one first opening (11) which defines a perforated design and a second opening (12) through which a contact pad (22) is exposed, wherein the card circuitry includes: a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), the contact pad (22), at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip (21), wherein the inductive circuitry includes at least one LED module (46) arranged proximate to the at least one first opening (11) and a second antenna coil (44) conductively coupled to the at least one LED module (46), and wherein the first substrate (30) incluType: GrantFiled: July 12, 2021Date of Patent: October 24, 2023Assignee: Smartflex Technology PTE LTDInventors: Eng Seng Ng, Sze Yong Pang, Gunenthiran Kailasam
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Publication number: 20230289553Abstract: The present disclosure relates to a smart card device comprising: a laminated core comprising: a front substrate (10); a first flexible sheet (20) having a card circuitry formed thereon; a first substrate (30); a second flexible sheet (40) having an inductive circuitry formed thereon, and a second substrate (50) in a top-to-bottom order, wherein the front substrate (10) provides at least one first opening (11) which defines a perforated design and a second opening (12) through which a contact pad (22) is exposed, wherein the card circuitry includes: a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), the contact pad (22), at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip (21), wherein the inductive circuitry includes at least one LED module (46) arranged proximate to the at least one first opening (11) and a second antenna coil (44) conductively coupled to the at least one LED module (46), and wherein the first substrate (30) incluType: ApplicationFiled: July 12, 2021Publication date: September 14, 2023Inventors: Eng Seng Ng, Sze Yong Pang, Gunenthiran Kailasam
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Publication number: 20230229725Abstract: The present invention belongs to the technical field of signal processing, and relates to an online fast processing method for real-time data based on edge computing. In the present invention, a dynamic online de-noising method is adopted to remove noise contained in speeds to ensure the effectiveness and accuracy of de-noising results; for the displacement integrated online, an efficient method is adopted for dynamic online de-noising to further reduce the effectiveness of drift in the displacement value on final integration results; and under the condition of ensuring the accuracy of an integration method, an integration algorithm is embedded into an edge device to realize fast calculation and analysis of data near a data source and realize dynamic fast integration of online signals based on edge computing, which provides effective references for efficient processing and calculation of data.Type: ApplicationFiled: May 5, 2022Publication date: July 20, 2023Inventors: Xueguan SONG, Liangliang YANG, Xiaonan LAI, Xiwang HE, Kunpeng LI, Yong PANG, Wei SUN, Peng LI
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Publication number: 20220408482Abstract: An LAA-based wireless transmission access method is disclosed including: acquiring, by a BBU, a signal format corresponding to an LBT startup indication, and delivering a corresponding LBT startup indication message; distributing, by a bridge unit, the startup indication message to an RRU; performing, by the RRU, spectrum scanning according to the signal format to obtain idle/busy state information of an unlicensed spectrum in the signal format, and reporting the same to the BBU via the bridge unit; determining, by the BBU, a preemptable unlicensed spectrum in the signal format according to the idle/busy state information, and delivering an occupancy message; delivering, by the bridge unit, the occupancy message to the RRU; determining, by the RRU, a signal source of the signal format in the occupancy message; if the signal source is a different manufacturer, switching to an intermediate radio frequency processing channel of a different manufacturer for transmission.Type: ApplicationFiled: October 29, 2020Publication date: December 22, 2022Inventors: Zhuyuan LIU, Diqiang ZHANG, Kai LIU, Yangfeng WANG, Yong PANG
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Patent number: 10685275Abstract: Embodiments of the invention relate to processes for fabricating a smart device, e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers interposing a flexible film having conductor pattern thereon, at least one flip chip for operating the smart card device is embedded in a first substrate such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip is arranged at a position in a first vertical plane; and a contact pad, for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.Type: GrantFiled: December 27, 2019Date of Patent: June 16, 2020Inventors: Eng Seng Ng, Sze Yong Pang
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Publication number: 20200134413Abstract: Embodiments of the invention relate to processes for fabricating a smart device, e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers interposing a flexible film having conductor pattern thereon, at least one flip chip for operating the smart card device is embedded in a first substrate such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip is arranged at a position in a first vertical plane; and a contact pad, for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.Type: ApplicationFiled: December 27, 2019Publication date: April 30, 2020Inventors: Eng Seng Ng, Sze Yong Pang
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Patent number: 10565487Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.Type: GrantFiled: February 15, 2018Date of Patent: February 18, 2020Assignee: SMARTFLEX TECHNOLOGY PTE LTDInventors: Eng Seng Ng, Sze Yong Pang, Cheng Kim Heng
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Patent number: 10558906Abstract: Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.Type: GrantFiled: November 22, 2016Date of Patent: February 11, 2020Assignees: SMARTFLEX TECHNOLOGY PTE LTDInventors: Eng Seng Ng, Sze Yong Pang
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Publication number: 20190294943Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.Type: ApplicationFiled: February 15, 2018Publication date: September 26, 2019Inventors: Eng Seng Ng, Sze Yong Pang, Cheng Kim Heng
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Publication number: 20180300597Abstract: Embodiments of the invention relate to processes for fabricating a smart device (200), e.g. smart card, and configurations for smart card devices with greater reliability and lifespan, and improved finish. In the smart card device comprising of laminated substrate layers (220, 240) interposing a flexible film (230) having conductor pattern thereon, at least one flip chip (250) for operating the smart card device is embedded in a first substrate (220) such that the first substrate provides an encapsulation to the at least one flip chip, wherein the at least one flip chip (250) is arranged at a position in a first vertical plane; and a contact pad (260), for providing electrical connection when the smart card device is inserted into a smart card reader, is arranged at a position in a second vertical plane, wherein the first vertical plane is non-overlapping with the second vertical plane.Type: ApplicationFiled: November 22, 2016Publication date: October 18, 2018Inventors: Eng Seng Ng, Sze Yong Pang