Patents by Inventor Yong Peng Yeo

Yong Peng Yeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AlCu hard mask process
    Patent number: 8733871
    Abstract: A process for forming a metal interconnection in an integrated circuit includes forming a first metal layer and a second metal layer on the first metal layer. Photoresist is placed on the second metal layer and patterned to form a mask. The second metal layer is etched. The mask is then removed and the first metal layer is patterned with the second metal layer acting as mask for the first metal layer.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: May 27, 2014
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: Jin Hao Chia, Yong Peng Yeo, Wei Leong Lim, Shi Min Veronica Goh, Mei Yu Muk
  • ALCu HARD MASK PROCESS
    Publication number: 20130100185
    Abstract: A process for forming a metal interconnection in an integrated circuit includes forming a first metal layer and a second metal layer on the first metal layer. Photoresist is placed on the second metal layer and patterned to form a mask. The second metal layer is etched. The mask is then removed and the first metal layer is patterned with the second metal layer acting as mask for the first metal layer.
    Type: Application
    Filed: October 25, 2011
    Publication date: April 25, 2013
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventors: Jin Hao Chia, Yong Peng Yeo, Wei Leong Lim, Shi Min Veronica Goh, Mei Yu Muk