Abstract: There is disclosed an inspection system that combines 2-D inspection and 3-D inspection of the components of an electronic device into one compact module. The inspection system of the present invention comprises a 2-D image acquisition assembly for inspecting 2-D criteria of the components, a 3-D image acquisition assembly for inspecting 3-D criteria of the components, and a computer for control and data analyzing. The 3-D image acquisition assembly comprises a 3-D image sensor and a 3-D light source. The 3-D light source is preferably a laser capable of generating a planar sheet of light that is substantially perpendicular to the inspection plane of the electronic device. The 2-D image acquisition assembly comprises a 2-D sensor and a 2-D light source positioned above the holder. The 2D and 3D image acquisition assemblies are arranged so that the 2D inspection and 3D inspection can be done while the electronic device is being held in one location.