Patents by Inventor Yongquan Tan

Yongquan Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11782867
    Abstract: A system includes a serial peripheral interface (SPI) buffer configured at an initial position. A low voltage differential signaling (LVDS) transceiver is configured above the SPI buffer. A capacitor couples the LVDS transceiver with the SPI buffer. The SPI buffer does not interfere with signals from the LVDS transceiver. The LVDS transceiver does not interfere with signals from the SPI buffer. An input/output (I/O) module receives a signal from the LVDS transceiver or the SPI buffer.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 10, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Dongxu Liu, Jie Lv, Yongquan Tan
  • Publication number: 20230267093
    Abstract: A system includes a serial peripheral interface (SPI) buffer configured at an initial position. A low voltage differential signaling (LVDS) transceiver is configured above the SPI buffer. A capacitor couples the LVDS transceiver with the SPI buffer. The SPI buffer does not interfere with signals from the LVDS transceiver. The LVDS transceiver does not interfere with signals from the SPI buffer. An input/output (I/O) module receives a signal from the LVDS transceiver or the SPI buffer.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Inventors: Dongxu LIU, Jie Lv, Yongquan Tan