Abstract: The present disclosure relates to an offset elimination operation of an internal operational amplifier of a data driving circuit and relates to a technique that applies different offset elimination methods for each position of an operational amplifier.

Abstract: A method for fabricating a multi-layer film for vacuum packaging, comprises the steps of: supplying a gas-impermeable film to a cooling roll; supplying a sealing film to a nip roll having an embossed pattern; extruding a molten polymer material toward a gap between the gas-impermeable film and the sealing film, thereby forming a multi-layer preform having a structure of gas-impermeable film-polymer layer-sealing film; and squeezing the multi-layer preform by passing the multi-layer preform through a nip between the nip roll and the cooling roll, so that the gas-impermeable film, the sealing film, and the polymer material of the multi-layer preform are laminated on each other simultaneously while the sealing film and the polymer material are embossed by the nip roll and the cooling roll.

Abstract: A polishing endpoint detecting device of a polishing apparatus detects a polishing endpoint of a polishing process by measuring light reflected from a surface of a semiconductor substrate being polished. The apparatus also includes a polishing pad and a rotary plate each of a light-transmitting material. The light is directed onto the surface of the semiconductor substrate through the polishing pad and the rotary plate and is scanned across the surface of the semiconductor substrate along a horizontal line which passes through the centers of the polishing pad and the semiconductor substrate. A light-measuring instrument measures a characteristic of the light reflected from the surface of the semiconductor substrate, and a processor detects the polishing endpoint by analyzing signals produced by the light measuring instrument.