Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: The present disclosure relates to a solid electrolytic capacitor, including a body comprising a tantalum wire disposed on one end thereof; a substrate, on which the body is disposed, comprising an insulating layer, first and second wiring layers respectively disposed on a first surface and a second surface, facing each other, of the insulating layer, and a via electrode penetrating the insulating layer to connect the first and second wiring layers to each other; and a connection portion connecting the tantalum wire to the first wiring layer.

Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.

Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.

Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

Abstract: Provided is a flexible organic electroluminescent device and a method for fabricating the same. In the flexible electroluminescent device, line hole patterns are formed on surfaces of a plurality of inorganic layers positioned in a pad region in which a flexible printed circuit board is connected to prevent a path of cracks caused by repeated bending and spreading of the organic electroluminescent device from spreading to the interior of the device.

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

Abstract: A substrate including a through hole only in one of a direction from a top surface to a bottom surface of the substrate or a direction from a bottom surface to a top surface of the substrate, a protruding portion of a metal layer protruding toward the through hole being removed, and a plating layer on an inner surface of the substrate on at least the through hole.

Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.

Abstract: Disclosed is an inductor and a method of manufacturing the same. The inductor may include a core insulating layer, a coil including at least one coil pattern formed on an upper part of the core insulating layer, at least one coil pattern formed on a lower part of the core insulating layer, and a through via configured to electrically connect the at least one coil pattern on the upper part and the lower part, and an insulating layer formed on the upper part and the lower part of the core insulating layer, the insulating layer embedding the coil.

Abstract: An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.

Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.

Abstract: A method of manufacturing a substrate includes forming a through hole in a substrate only in one of a direction from a top surface to a bottom surface of the substrate or a direction from a bottom surface to a top surface of the substrate, removing a protruding portion of a metal layer provided in the substrate, protruding toward the through hole, and forming a plating layer on an inner surface of the substrate forming at least the through hole.

Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.