Patents by Inventor Yong Shin LEE

Yong Shin LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EXTRUSION DIE USING SHOCK-ABSORBING PAD AND METHOD FOR MANUFACTURING EXTRUSION
    Publication number: 20150298189
    Abstract: An extrusion die using a shock-absorbing pad and a method for manufacturing an extrusion. A shock-absorbing pad is inserted between a material to be processed and a die such that the shock-absorbing pad is deformed during extrusion to form an optimal die half angle, thereby efficiently extruding the material to be processed. The extrusion die for extruding the material to be processed includes a container for accommodating a material to be processed, a die which is mounted on the front of the container, and which has, in the center thereof, a die hole that is a path through which the material to be processed is extruded, a shock-absorbing pad inserted between the material to be processed and the die, and a ram for pressing the material to be processed.
    Type: Application
    Filed: June 13, 2013
    Publication date: October 22, 2015
    Inventors: Sang Mok LEE, Geun An LEE, Hoon Jae PARK, Eung Zu KIM, Sung Joo LIM, Deog Jae YOON, Jong Sup LEE, Ki Ho JUNG, Yong Bae KIM, Yong Shin LEE, Sang Hun YOON