Patents by Inventor Yong Sik Ahn

Yong Sik Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
    Patent number: 8232366
    Abstract: The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: July 31, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Dong-seok Kim, Yong-sik Ahn, Kyung-jun Kim, Mi-hie Yi
  • Thermally curable resin composition with extended storage stability and good adhesive property
    Patent number: 7671121
    Abstract: This invention provides a thermally curable resin copolymer (A), composed mainly of an ethylenically unsaturated monomer (a-1), which produces an acid via decomposition at 150° C. or more, an ethylenically unsaturated monomer (a-2) containing an epoxy group copolymerizable with the ethylenically unsaturated monomer (a-1), and an ethylenically unsaturated monomer (a-3) having a reactive silyl group; a thermally curable resin composition including the thermally curable resin copolymer; a cured film formed from the composition; and a liquid crystal display including the cured film. The thermally curable resin composition has extended storage stability and can be formed into the cured film having good adhesion to a substrate.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: March 2, 2010
    Assignee: LG Chem. Ltd.
    Inventors: Dong Seok Kim, Seung Hee Lee, Sang Kyu Kwak, Yong Sik Ahn
  • Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
    Publication number: 20070093640
    Abstract: The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps.
    Type: Application
    Filed: March 24, 2004
    Publication date: April 26, 2007
    Inventors: Dong-seok Kim, Yong-sik Ahn, Kyung-jun Kim, Mi-hie Yi