Patents by Inventor Yong-Sik R. Kim

Yong-Sik R. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
    Patent number: 6811470
    Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: November 2, 2004
    Assignee: Applied Materials Inc.
    Inventors: Benjamin A. Bonner, Anand N. Iyer, Deepak N. Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong-Sik R. Kim, Christopher W. Smith, Huanbo Zhang
  • Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
    Publication number: 20030036339
    Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
    Type: Application
    Filed: July 12, 2002
    Publication date: February 20, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Benjamin A. Bonner, Anand N. Iyer, Deepak N. Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong-Sik R. Kim, Christopher W. Smith, Huanbo Zhang