Patents by Inventor Yong Soo An

Yong Soo An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board for signal transmission and method of manufacturing the same
    Publication number: 20120080224
    Abstract: Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.
    Type: Application
    Filed: September 20, 2011
    Publication date: April 5, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Gwang Yoo, Bong Kyu Choi, Yong Soo An