Patents by Inventor Yong Sup Choi
Yong Sup Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11835230Abstract: Provided is a cyclonic plasma melting furnace. A melting furnace chamber body includes an inlet through which waste is input and an outlet through which air or gas is discharged. The outlet is provided in a direction opposite to the inlet. At least one plasma torch is provided on the melting furnace chamber body so as to be inclined at a predetermined angle with respect to a direction in which the air or the gas is discharged through the outlet.Type: GrantFiled: December 5, 2020Date of Patent: December 5, 2023Assignee: KOREA INSTITUTE OF FUSION ENERGYInventors: Yong Sup Choi, Dae Hyun Choi, In Je Kang, Ji Hun Kim, Sung Hoon Jee, Dong Hun Shin, Seong Bong Kim, Soon Mo Hwang, Chi Kyu Choi
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Patent number: 11776819Abstract: A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.Type: GrantFiled: February 13, 2019Date of Patent: October 3, 2023Assignee: KOREA INSTITUTE OF FUSION ENERGYInventors: Dong Chan Seok, Tai Hyeop Lho, Yong Ho Jung, Yong Sup Choi, Kang Il Lee, Seung Ryul Yoo, Soo Ouk Jang
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Publication number: 20230038043Abstract: Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.Type: ApplicationFiled: January 22, 2021Publication date: February 9, 2023Applicant: KOREA INSTITUTE OF FUSION ENERGYInventors: Seung Ryul YOO, Yong Sup CHOI, Yong Ho JUNG, Dong Chan SEOK, Kang Il LEE
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Publication number: 20220230858Abstract: Disclosed is a window device for diagnosis of plasma OES (Optical Emission Spectroscopy).Type: ApplicationFiled: May 28, 2020Publication date: July 21, 2022Applicant: KOREA INSTITUTE OF FUSION ENERGYInventors: Kang Il LEE, Yong Sup CHOI, Young Woo KIM, Jong Sik KIM
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Patent number: 11268191Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.Type: GrantFiled: November 1, 2018Date of Patent: March 8, 2022Assignee: KOREA INSTITUTE OF FUSION ENERGYInventors: Yong Sup Choi, Kang Il Lee, Dong Chan Seok, Soo Ouk Jang, Jong Sik Kim, Seung Ryul Yoo
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Publication number: 20220065446Abstract: Provided is a cyclonic plasma melting furnace. A melting furnace chamber body includes an inlet through which waste is input and an outlet through which air or gas is discharged. The outlet is provided in a direction opposite to the inlet. At least one plasma torch is provided on the melting furnace chamber body so as to be inclined at a predetermined angle with respect to a direction in which the air or the gas is discharged through the outlet.Type: ApplicationFiled: December 5, 2020Publication date: March 3, 2022Applicant: KOREA INSTITUTE OF FUSION ENERGYInventors: Yong Sup Choi, Dae Hyun Choi, In Je Kang, Ji Hun Kim, Sung Hoon Jee, Dong Hun Shin, Seong Bong Kim, Soon Mo Hwang, Chi Kyu Choi
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Publication number: 20200402810Abstract: A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.Type: ApplicationFiled: February 13, 2019Publication date: December 24, 2020Inventors: Dong Chan SEOK, Tai Hyeop LHO, Yong Ho JUNG, Yong Sup CHOI, Kang Il LEE, Seung Ryul YOO, Soo Ouk JANG
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Publication number: 20200216954Abstract: An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.Type: ApplicationFiled: November 1, 2018Publication date: July 9, 2020Inventors: Yong Sup CHOI, Kang Il LEE, Dong Chan SEOK, Soo Ouk JANG, Jong Sik KIM, Seung Ryul YOO
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Publication number: 20190226078Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.Type: ApplicationFiled: March 28, 2019Publication date: July 25, 2019Inventors: Hyun-Sook Park, Chang-Mog Jo, Hee-Cheol Kang, Yun-Mi Lee, Un-Cheol Sung, Yong-Sup Choi, Jong-Heon Kim, Jae-Kwang Ryu
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Patent number: 10287671Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.Type: GrantFiled: May 3, 2016Date of Patent: May 14, 2019Assignee: Samsung Display Co., Ltd.Inventors: Hyun-Sook Park, Chang-Mog Jo, Hee-Cheol Kang, Yun-Mi Lee, Un-Cheol Sung, Yong-Sup Choi, Jong-Heon Kim, Jae-Kwang Ryu
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Patent number: 10246769Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.Type: GrantFiled: December 28, 2010Date of Patent: April 2, 2019Assignee: Samsung Display Co., Ltd.Inventors: Hyun-Sook Park, Chang-Mog Jo, Hee-Cheol Kang, Yun-Mi Lee, Un-Cheol Sung, Yong-Sup Choi, Jong-Heon Kim, Jae-Kwang Ryu
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Patent number: 9450140Abstract: A thin film deposition apparatus used to manufacture large substrates on a mass scale and that allows high-definition patterning, and a method of manufacturing an organic light-emitting display apparatus using the same, the apparatus includes a loading unit fixing a substrate onto an electrostatic chuck; a deposition unit including a chamber maintained in a vacuum state and a thin film deposition assembly disposed in the chamber, separated from the substrate by a predetermined distance, to deposit a thin film on the substrate fixed on the electrostatic chuck; an unloading unit separating the substrate on which a deposition process is completed, from the electrostatic chuck; a first circulation unit sequentially moving the electrostatic chuck on which the substrate is fixed, to the loading unit, the deposition unit, and the unloading unit; and a second circulation unit returning the electrostatic chuck separated from the substrate to the loading unit from the unloading unit, wherein the first circulation unitType: GrantFiled: August 27, 2010Date of Patent: September 20, 2016Assignee: Samsung Display Co., Ltd.Inventors: Chang-Mog Jo, Jong-Heon Kim, Yong-Sup Choi, Sang-Soo Kim, Hee-Cheol Kang, Young-Mook Choi
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Publication number: 20160244872Abstract: A thin film deposition apparatus that can be simply applied to produce large-sized display devices on a mass scale and that improves manufacturing yield. The thin film deposition apparatus includes a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in a second direction that is perpendicular to the first direction. A deposition is performed while the substrate or the thin film deposition apparatus moves relative to each other in the first direction, and the deposition source, the deposition source nozzle unit, and the patterning slit sheet are formed integrally with each other.Type: ApplicationFiled: May 3, 2016Publication date: August 25, 2016Inventors: Hyun-Sook Park, Chang-Mog Jo, Hee-Cheol Kang, Yun-Mi Lee, Un-Cheol Sung, Yong-Sup Choi, Jong-Heon Kim, Jae-Kwang Ryu
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Patent number: 9279177Abstract: A thin film deposition apparatus includes: a deposition source for discharging a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and having a plurality of patterning slits arranged in the first direction; a barrier plate assembly including a plurality of barrier plates that are disposed between the deposition source nozzle unit and the patterning slit sheet in the first direction, the plurality of barrier plates partitioning a deposition space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces; and a capacitive vacuum gauge disposed at a side of the deposition source and configured to measure a pressure inside the deposition source.Type: GrantFiled: June 9, 2011Date of Patent: March 8, 2016Assignee: Samsung Display Co., Ltd.Inventors: Yong-Sup Choi, Myeng-Woo Nam
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Patent number: 9224591Abstract: A method of forming a thin film on a substrate includes arranging the substrate to face a thin film deposition apparatus; and discharging a deposition material via a deposition source of the thin film deposition apparatus onto the substrate; wherein a deposition source nozzle unit of the thin film deposition apparatus is disposed at a side of the deposition source and includes a plurality of deposition source nozzles arranged in a first direction; wherein a patterning slit sheet of the thin film deposition apparatus is disposed to be between the deposition source nozzle unit and the substrate, the patterning slit sheet including a plurality of patterning slits, and wherein each of the patterning slits includes a plurality of sub-slits.Type: GrantFiled: October 15, 2013Date of Patent: December 29, 2015Assignee: Samsung Display Co., Ltd.Inventors: Yong-Sup Choi, Kang-Il Lee, Chang Mog Jo
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Patent number: 9147557Abstract: A sputter device including a plurality of targets having magnetism; a reflector having magnetism and arranged between neighboring targets of the plurality of targets; a wave guide having magnetism and arranged adjacent the targets, the wave guide forming a guide space for guiding microwaves; and a limiter having magnetism and arranged adjacent the wave guide, the limiter forming an electron cyclotron resonance area together with the targets, the reflector, and the wave guide.Type: GrantFiled: April 13, 2012Date of Patent: September 29, 2015Assignee: Samsung Display Co., Ltd.Inventors: Yong-Sup Choi, Myung-Soo Huh
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Patent number: 8876975Abstract: A thin film deposition apparatus can be simply applied to produce large-sized display devices on a mass scale and improves manufacturing yield. The thin film deposition apparatus for forming a thin film on a substrate includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; wherein each of the patterning slits includes a plurality of sub-slits.Type: GrantFiled: October 19, 2010Date of Patent: November 4, 2014Assignee: Samsung Display Co., Ltd.Inventors: Yong-Sup Choi, Kang-ll Lee, Chang Mog Jo
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Patent number: 8865252Abstract: A thin film deposition apparatus that can be easily used to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus.Type: GrantFiled: February 22, 2011Date of Patent: October 21, 2014Assignee: Samsung Display Co., Ltd.Inventors: Yong Sup Choi, Myeng-Woo Nam, Jong-Won Hong, Seok-Rak Chang, Eun-Sun Choi
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Patent number: 8709161Abstract: A thin film deposition apparatus and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus. The thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of which includes: a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits arranged in a first direction; and a barrier plate assembly that is disposed between the deposition source nozzle unit and the patterning slit sheet, in the first direction. The barrier plate assembly includes a plurality of barrier plates that partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces.Type: GrantFiled: August 3, 2010Date of Patent: April 29, 2014Assignee: Samsung Display Co., Ltd.Inventors: Ji-Sook Oh, Yong-Sup Choi, Jong-Heon Kim, Hee-Cheol Kang, Yun-Mi Lee, Chang-Mog Jo
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Publication number: 20140045343Abstract: A thin film deposition apparatus can be simply applied to produce large-sized display devices on a mass scale and improves manufacturing yield. The thin film deposition apparatus for forming a thin film on a substrate includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; and a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; wherein each of the patterning slits includes a plurality of sub-slits.Type: ApplicationFiled: October 15, 2013Publication date: February 13, 2014Applicant: SAMSUNG DISPLAY CO., LTD.Inventors: Yong-Sup Choi, Kang-Il Lee, Chang Mog Jo