Patents by Inventor Yong Tae JUN

Yong Tae JUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having overhang portion
    Patent number: 9281267
    Abstract: A semiconductor package may include a substrate, and a structural body disposed over the substrate. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. The semiconductor package may include one or more bonding pads disposed on the overhang portion, and one or more wires electrically coupling the bonding pads to the substrate. The semiconductor package may include a wire fixing film attached onto the structural body, and overhanging out over the side surface of the structural body to fix the one or more wires.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: March 8, 2016
    Assignee: SK Hynix Inc.
    Inventor: Yong Tae Jun
  • SEMICONDUCTOR PACKAGE HAVING OVERHANG PORTION
    Publication number: 20160056122
    Abstract: A semiconductor package may include a substrate, and a structural body disposed over the substrate. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. The semiconductor package may include one or more bonding pads disposed on the overhang portion, and one or more wires electrically coupling the bonding pads to the substrate. The semiconductor package may include a wire fixing film attached onto the structural body, and overhanging out over the side surface of the structural body to fix the one or more wires.
    Type: Application
    Filed: November 21, 2014
    Publication date: February 25, 2016
    Inventor: Yong Tae JUN