Abstract: An apparatus for fabricating a semiconductor device includes: a reactive chamber having an inlet and an outlet for a gas and being electrically grounded; a susceptor installed in the reactive chamber for mounting a wafer thereon and being electrically insulated with the reactive chamber; and an RF generator for applying an RF electric power to the susceptor. A method for cleaning the apparatus for fabricating a semiconductor device includes the steps of: injecting a plasma forming gas through the gas inlet; and moving the susceptor in the vertical direction of the face of the wafer while applying the RF electric power to the susceptor, to control the position and the density of the plasma. Since the plasma is formed even at the shadow area, such as the lower space of the susceptor within the reactive chamber where plasma could be hardly formed, there is no need to clean separately the lower space of the reactive chamber. Thus, the cleaning process is simplified.

Abstract: A foamed and expanded low density polyethylene sheet or tube possesses both superior buoyancy and thermal resistance characteristics. The sheet or tube is made by a process including mixing a low density polyethylene with a blowing agent, surface activation agent and, preferably, a separation agent, heating the mixture at different temperatures to first melt the mixture and then gasify the blowing agent to expand the polyethylene cells, cooling the melted mass to partially harden and shrink the expanded cells, further expanding the cells by introducing a second gaseous blowing agent, cutting, extruding and cooling the expanded mass, forming a sheet or tube from the cooling mass, and finally cooling the sheet or tube for at least 24 hours. A buoyant, thermal resistant, water-repellent and moisture resistant sheet or tube results, which can be used, for example, as a liner for garments, including sports, business and military garments and other related equipment.

Abstract: A foamed and expanded low density polyethylene sheet or tube possesses both superior buoyancy and thermal resistance characteristics. The sheet or tube is made by a process comprising mixing a low density polyethylene with a blowing agent, surface activation agent and, preferably, a separation agent, heating the mixture at different temperatures to first melt the mixture and then gasify the blowing agent to expand the polyethylene cells, cooling the melted mass to partially harden and shrink the expanded cells, further expanding the cells by introducing a second gaseous blowing agent, cutting, extruding and cooling the expanded mass, forming a sheet or tube from the cooling mass, and finally cooling the sheet or tube for at least 24 hours. A buoyant, thermal resistant, water-repellent and moisture resistant sheet or tube results, which can be used, for example, as a liner for garments, including sports, business and military garments and other related equipment.

Abstract: A foamed and expanded low density polyethylene sheet or tube possesses both superior buoyancy and thermal resistance characteristics. The sheet or tube is made by a process comprising mixing a low density polyethylene with a blowing agent, surface activation agent and, preferably, a separation agent, heating the mixture at different temperatures to first melt the mixture and then gasify the blowing agent to expand the polyethylene cells, cooling the melted mass to partially harden and shrink the expanded cells, further expanding the cells by introducing a second gaseous blowing agent, cutting, extruding and cooling the expanded mass, forming a sheet or tube from the cooling mass, and finally cooling the sheet or tube for at least 24 hours. A buoyant, thermal resistant, water-repellent and moisture resistant sheet or tube results, which can be used, for example, as a liner for garments, including sports, business and military garments and other related equipment.

Abstract: The shock or energy absorber disclosed herein utilizes an apertured plate maintained under the normal level of liquid flowing in a piping system and disposed between the normal liquid flow path and a cavity pressurized with a compressible gas. The degree of openness (or porosity) of the plate is between 0.01 and 0.60. The energy level of a shock wave travelling down the piping system thus is dissipated by some of the liquid being jetted through the apertured plate toward the cavity. The cavity is large compared to the quantity of liquid jetted through the apertured plate, so there is little change in its volume. The porosity of the apertured plate influences the percentage of energy absorbed.