Patents by Inventor Yong-won HWANG

Yong-won HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080165514
    Abstract: A printed circuit board (PCB) having a multi-layered structure for improving shielding against electromagnetic interference, the PCB including one or more signal layers and an outer grounding layer located on an outermost surface of the PCB. Accordingly, the radiation of electromagnetic waves to the outside from the outer grounding layer is prevented.
    Type: Application
    Filed: June 13, 2007
    Publication date: July 10, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yong-won HWANG