Abstract: A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of the capacitor module, in soldering the bus-bar to capacitor devices. The lead frame attached to polar plates by soldering is formed thinner than the other parts of the bus-bar, and opening parts having an oval or polygonal shape are formed on a surface of the bus-bar so that two adjoining capacitor devices can be exposed. The lead frame is formed in the opening in order for soldering with the polar plates of the capacitor device.

Abstract: A metallized plastic film is formed by winding two sheets of film vapor-deposited with an electrode metal as one group and a film capacitor, comprising; three individual splittings of electrode metal by predetermined width and length and then adjoining of splitting parts. Accordingly, self-heating of the film capacitor can be restrained and a capacitance reduction rate caused by the operation of the fuse parts can be reduced.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of the capacitor module, in soldering the bus-bar to capacitor devices. The lead frame attached to polar plates by soldering is formed thinner than the other parts of the bus-bar, and opening parts having an oval or polygonal shape are formed on a surface of the bus-bar so that two adjoining capacitor devices can be exposed. The lead frame is formed in the opening in order for soldering with the polar plates of the capacitor device.

Abstract: A metallized plastic film is formed by winding two sheets of film vapor-deposited with an electrode metal as one group and a film capacitor, comprising; three individual splittings of electrode metal by predetermined width and length and then adjoining of splitting parts. Accordingly, self-heating of the film capacitor can be restrained and a capacitance reduction rate caused by the operation of the fuse parts can be reduced.