Patents by Inventor Yong Won Yu

Yong Won Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8165645
    Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: April 24, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Hwa Lee, Yong Won Yu, Hyun Sam Mun, Young Suk Kim
  • Publication number: 20100035671
    Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
    Type: Application
    Filed: December 10, 2008
    Publication date: February 11, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Hwa LEE, Yong Won Yu, Hyun Sam Mun, Young Suk Kim