Patents by Inventor Yong Woo Hong

Yong Woo Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
    Patent number: 8394493
    Abstract: A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: March 12, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Yong Woo Hong, Su Mi Im, Wan Jung Kim, Ki Sung Jung, Chang Beom Chung
  • Adhesive film composition, associated dicing die bonding film, die package, and associated methods
    Patent number: 8211540
    Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: July 3, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Su Mi Im, Sang Jin Kim, Chang Beom Chung
  • DIE ADHESIVE FILM, REEL FOR DIE ADHESIVE FILM, MOUNTING APPARATUS AND ELECTRONIC DEVICE COMPRISING THE SAME
    Publication number: 20110151207
    Abstract: A die adhesive film includes a base film and an end point detection film. The base film includes bonding portions. The bonding portions are arranged in a series on the base film and are capable of being bonded to surfaces of the wafers. The end point detection film includes an end connected to the base film and has at least one end point mark for indicating an end point of the bonding portions on the base film at which the series of bonding portions on the base film is finished.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Inventors: Yong Woo HONG, Duck Su Lee, Sang Jin Choi, Dae Young Hong
  • Adhesive film composition, associated dicing die bonding film, and die package
    Patent number: 7863758
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: January 4, 2011
    Assignee: Cheil Industries, Inc.
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha
  • Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
    Publication number: 20090162650
    Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 25, 2009
    Inventors: Yong Woo Hong, Wan Jung Kim, Su Mi Im, Ah Ram Pyun, Chul Jeong, Sang Jin Kim, Chang Beom Chung
  • Adhesive film composition, associated dicing die bonding film, die package, and associated methods
    Publication number: 20090110940
    Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler
    Type: Application
    Filed: October 8, 2008
    Publication date: April 30, 2009
    Inventors: Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Su Mi Im, Sang Jin Kim, Chang Beom Chung
  • Adhesive film composition, associated dicing die bonding film, and die package
    Publication number: 20080145668
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 19, 2008
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha
  • Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
    Publication number: 20080102284
    Abstract: A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
    Type: Application
    Filed: July 19, 2007
    Publication date: May 1, 2008
    Inventors: Yong Woo Hong, Su Mi Im, Wan Jung Kim, Ki Sung Jung, Chang Beom Chung