Patents by Inventor Yong Yeop PARK

Yong Yeop PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
    Patent number: 11639438
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yong Yeop Park, Dong Hwan Lee, Kyoung Chui Bae, Min Joon Seo, Chui Ho Lee
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20220145066
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Application
    Filed: September 20, 2021
    Publication date: May 12, 2022
    Inventors: Yong Yeop PARK, Dong Hwan LEE, Kyoung Chul BAE, Min Joon SEO, Chul Ho LEE
  • CLEANING COMPOSITION FOR SEMICONDUCTOR DEVICE AND METHOD OF CLEANING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20120172272
    Abstract: A cleaning composition for a semiconductor device and a method of cleaning a semiconductor device, the composition including about 0.001 to about 0.5 wt % of a fluorine compound, based on a total weight of the composition; about 0.1 to about 10 wt % of an alkyl, aryl, or aralkyl-substituted ammonium hydroxide compound, based on a total weight of the composition; about 0.1 to about 10 wt % of a nitrogen-containing carboxylic acid, based on a total weight of the composition; about 0.01 to about 1 wt % of a water-soluble polymer compound, based on a total weight of the composition; and water.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Inventors: Yong Yeop PARK, Jung Min CHOI, Go Un KIM, Kang Su AN