Patents by Inventor Yong Yong Xia

Yong Yong Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with stacked devices
    Patent number: 8018039
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 13, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
    Publication number: 20090224389
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 10, 2009
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu