Patents by Inventor Yong Yoon Cho

Yong Yoon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160081195
    Abstract: The present invention relates to a detach core substrate and a method of manufacturing a detach core substrate. In accordance with one embodiment of the present invention, there is proposed a detach core substrate that a conductive layer including a metal layer with an etching property different from copper is formed on a top surface and a bottom surface of an insulating layer formed thereon a surface roughness. At this time, the contact interface between the top surface and the bottom surface of the insulating layer is the detachment interface to be separated during the manufacture of the circuit board. In addition, a method of manufacturing the detach core substrate is proposed.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 17, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Yoon CHO, Ki Hwan KIM, Gun Woo KIM, Sung Won JEONG, Gi Ho HAN, Da Hee KIM
  • Publication number: 20160021736
    Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a first insulating layer; a second insulating layer formed below the first insulating layer; a via pad formed on an upper surface of the second insulating layer and formed so as to be buried in the second insulating layer; a double via formed on an upper surface of the via pad, formed so as to penetrate through the first insulating layer, and including an auxiliary via and a first via; and a second via formed on a lower surface of the via pad and formed so as to penetrate through the second insulating layer.
    Type: Application
    Filed: July 21, 2015
    Publication date: January 21, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gi Ho HAN, Gun Woo KIM, Sung Won JEONG, Ki Hwan KIM, Da Hee KIM, Yong Yoon CHO
  • Publication number: 20150129291
    Abstract: Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Won JEONG, Yong Yoon Cho, Jung Hyun Park, Ki Hwan Kim, Da Hee Kim, Gi Ho Han
  • Publication number: 20150101857
    Abstract: There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 16, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Da Hee KIM, Jung Hyun PARK, Yong Yoon CHO, Sung Won JEONG, Gi Ho HAN, Ki Hwan KIM
  • Publication number: 20150061093
    Abstract: Disclosed herein is an interposer, including: an interposer substrate configured by stacking an insulating layer of one layer or more and interlayer connected through a via; a cavity penetrating through a center of the interposer substrate in a thickness direction; and a connection electrode having a post part which is disposed on at least one of an upper surface and a lower surface of the interposer substrate, thereby increasing electrical characteristics and reducing manufacturing cost and time.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Ki Hwan KIM, Jung Hyun PARK, Yong Yoon CHO, Sung Won JEONG, Da Hee KIM, Gi Ho HAN
  • Publication number: 20140102767
    Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.
    Type: Application
    Filed: March 18, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myung Sam Kang, Ki Hwan Kim, Yong Yoon Cho, Sung Won Jeong, Sang Hyuck Oh, Da Hee Kim, Yoong Oh, Ki Young Yoo