Abstract: The present invention relates to monobactam compounds of Formula I: and pharmaceutically acceptable salts thereof. The present invention also relates to compositions which comprise a monobactam compound of structural formula I or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable carrier. The invention further relates to methods for treating a bacterial infection comprising administering to the patient a therapeutically effective amount of a compound of structural formula I, either alone or in combination with a therapeutically effective amount of a second beta-lactam antibiotic.

Abstract: A joystick includes a stick head, an actuating component, a substrate, a bearing base, a resilient recovering component and a constraining component. The actuating component has a first end and a second end opposite to each other. The first end is connected to the stick head, and an identification feature is disposed on the second end. The substrate has a detection module used to detect the identification feature and determine motion of the stick head. The bearing base is disposed on the substrate. An opening portion of the bearing base aligns with the detection module and the actuating component. The resilient recovering component is disposed between the substrate and the bearing base. The constraining component is disposed on the resilient recovering component and movably disposed inside the opening portion, and used to abut against the actuating component in a detachable manner.

Abstract: The present disclosure relates to an integrated chip structure. The integrated chip structure includes a first source/drain region and a second source/drain region disposed within a substrate. A select gate is over the substrate between the first source/drain region and the second source/drain region. A ferroelectric random access memory (FeRAM) device is over the substrate between the select gate and the first source/drain region. A transistor device is disposed on an upper surface of the substrate. The substrate has a recessed surface that is below the upper surface of the substrate and that is laterally separated from the upper surface of the substrate by a boundary isolation structure extending into a trench within the upper surface of the substrate. The FeRAM device is arranged over the recessed surface.

Abstract: A system for detecting a semiconductor process and a method for detecting a semiconductor process are provided. The system for detecting a semiconductor process includes a memory for storing computer-executable instructions and a processor for executing the computer-executable instructions to implement functions of a first acquisition module and a matching module. The first acquisition module is configured to acquire a preset process recipe including preset process recipe parameters, and is further configured to initiate a matching request to the matching module and send the preset process recipe to the matching module. The matching module is configured to acquire, based on the matching request, a production process recipe including a production process recipe flow and production process recipe parameters, and is further configured to determine whether the production process recipe flow is correct and determine whether the production process recipe parameters meet the preset process recipe parameters.

Abstract: A touch input device includes a planar location sensing board, a depth sensing layer, a first interpretation unit, a second interpretation unit, and a processing unit. The planar location sensing board senses a first electrical variation of different locations in the directions parallel to the planar location sensing board due to an object approaching or touching the planar location sensing board. The depth sensing layer is disposed below the planar location sensing board and separated by a distance from the planar location sensing board. The depth sensing layer senses a second electrical variation corresponding to a degree in which the object presses the planar location sensing board. The first interpretation unit is electrically connected to the planar location sensing board. The second interpretation unit is electrically connected to the depth sensing layer. The processing unit determines a three-dimensional touch location of the object. A touch sensing method is also provided.

Abstract: A touch input device includes a planar location sensing board, a depth sensing layer, a first interpretation unit, a second interpretation unit, and a processing unit. The planar location sensing board senses a first electrical variation of different locations in the directions parallel to the planar location sensing board due to an object approaching or touching the planar location sensing board. The depth sensing layer is disposed below the planar location sensing board and separated by a distance from the planar location sensing board. The depth sensing layer senses a second electrical variation corresponding to a degree in which the object presses the planar location sensing board. The first interpretation unit is electrically connected to the planar location sensing board. The second interpretation unit is electrically connected to the depth sensing layer. The processing unit determines a three-dimensional touch location of the object. A touch sensing method is also provided.

Abstract: A touch input device including a carrying board, a plurality of first electrode pads, and a plurality of conductive lines is provided. The carrying board includes a plurality of cantilever portions and a plurality of connecting portions. The connecting portions are respectively connected to the cantilever portions. The first electrode pads are respectively disposed on the cantilever portions and configured to sense capacitance variation due to an object approaching or touching the carrying board. The conductive lines extend on the connecting portions and are respectively connected to the first electrode pads. A manufacturing method of a touch input device and a touch sensing method are also provided.

Abstract: A touch input device including a carrying board, a plurality of first electrode pads, and a plurality of conductive lines is provided. The carrying board includes a plurality of cantilever portions and a plurality of connecting portions. The connecting portions are respectively connected to the cantilever portions. The first electrode pads are respectively disposed on the cantilever portions and configured to sense capacitance variation due to an object approaching or touching the carrying board. The conductive lines extend on the connecting portions and are respectively connected to the first electrode pads. A manufacturing method of a touch input device and a touch sensing method are also provided.