Abstract: The present invention belongs to the field of medicinal chemistry and relates to a class of substituted tricyclic compounds as PRMT5 inhibitors and the use thereof. Specifically, the present invention provides a compound represented by formula (A) or an isomer, pharmaceutically acceptable salt, solvate, crystal or prodrug thereof, a preparation method therefor, a pharmaceutical composition containing the compounds, and the use of the compounds or the composition for treating a disease mediated by PRMT5. The compounds of the present invention show significant inhibitory activity on PRMT5.

Abstract: The present disclosure discloses a lamp body and a lamp cup. An installation ring platform is provided on a bottom of the lamp cup, and the installation ring platform is provided with a plurality of wire clamping grooves the plurality of wire clamping grooves are arranged along a circumferential direction of the installation ring platform; and a bayonet that is provided on a top of the wire clamping groove, and the bayonet is located on a top surface of the installation ring platform.

Abstract: A system may have a display that includes a plurality of light sources such as light-emitting diodes. The display may be an exterior display that is routinely operated in daytime conditions where ambient light levels are very high. To increase contrast in an exterior display, the display may include a sunlight blocking element. A static sunlight blocking element may include a louver film with asymmetric light blocking portions. The system may include an ambient light sensor that is configured to determine ambient light levels. Based on the detected ambient light level, control circuitry in the system may adjust one or more adjustable components in the display. The display may include an adjustable diffuser that has at least two states with different haze levels. The display may include an adjustable tint layer that has at least two states with different transmission levels.

Abstract: A lamp connector includes an insulating connector body, a first pressing cover, and a second pressing cover. The insulating connector body includes a first electrical connection part, a second electrical connection part, and an electrical connection structure; the first electrical connection part includes a first base, and a first end of the first pressing cover is mounted on the first base through a first rotating shaft structure, a second end of the first pressing cover is fixed to the first base through a first fixing structure. The second electrical connection part includes a second base, and a third end of the second pressing cover is mounted on the second base through a second rotating shaft structure, a fourth end of the second pressing cover is fixed to the second base through a second fixing structure.

Abstract: Provided are a parameter adjustment method, a server, and a storage medium. The parameter adjustment method comprises: acquiring an index value of a first performance index of a device; searching for superiority of each of a plurality of candidate values for a target operation parameter of the device on the basis of the index value of the first performance index, wherein the superiority of each of the plurality of candidate values refers to a superiority level of each of the plurality of candidate values that each of the plurality of candidate values is set to the target operation parameter on the basis of the index value of the first performance index; and selecting one candidate value as a set value of the target operation parameter after the adjustment according to the searched superiority of each of the plurality of candidate values.

Abstract: The present disclosure discloses a lamp body and a lamp cup. An installation ring platform is provided on a bottom of the lamp cup, and the installation ring platform is provided with a plurality of wire clamping grooves the plurality of wire clamping grooves are arranged along a circumferential direction of the installation ring platform; and a bayonet that is provided on a top of the wire clamping groove, and the bayonet is located on a top surface of the installation ring platform.

Abstract: The disclosure discloses a light source module of a luminaire including a light source board, a heat dissipating component, a first sleeving component, and a second sleeving component, wherein the heat dissipating component includes a mounting base portion; the second sleeving component is sleeved on the first sleeving component and presses the light source board on the mounting base portion; the light source board includes illuminators; the first sleeving component has an avoidance space, and the illuminators are located in the avoidance space; and at least a region, opposing to the illuminators, of the second sleeving component is a light transmission region.

Abstract: A lamp connector includes an insulating connector body, a first pressing cover, and a second pressing cover. The insulating connector body includes a first electrical connection part, a second electrical connection part, and an electrical connection structure; the first electrical connection part includes a first base, and a first end of the first pressing cover is mounted on the first base through a first rotating shaft structure, a second end of the first pressing cover is fixed to the first base through a first fixing structure. The second electrical connection part includes a second base, and a third end of the second pressing cover is mounted on the second base through a second rotating shaft structure, a fourth end of the second pressing cover is fixed to the second base through a second fixing structure.

Abstract: The disclosure discloses a light source module of a luminaire including a light source board, a heat dissipating component, a first sleeving component, and a second sleeving component, wherein the heat dissipating component includes a mounting base portion; the second sleeving component is sleeved on the first sleeving component and presses the light source board on the mounting base portion; the light source board includes illuminators; the first sleeving component has an avoidance space, and the illuminators are located in the avoidance space; and at least a region, opposing to the illuminators, of the second sleeving component is a light transmission region.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout. The IC design layout includes several wiring layers in some embodiments. The IC design layout includes a substrate that has at least one through-silicon via (“TSV”). The method divides the IC design layout into a set of elements. The method identifies a temperature distribution for the IC design layout by using the set of elements. In some embodiments, at least one element includes a metal component and a non-metal component. The non-metal component is silicon in some embodiments, and a dielectric in other embodiments.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC design layout into a set of elements, where at least one element includes several wires. The method computes a set of conductivity groups of values for the set of elements. The method identifies a temperature distribution for the IC design layout based on the set of conductivity groups of values. In some embodiments, each of these elements corresponds to a particular portion of a particular layer of the IC design layout. Each element includes several nodes. Each conductivity group of values is defined by entry values. Each entry value describes how heat flow at a particular node of the element is affected by a temperature change at another particular node of the element.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout. The IC design layout includes several wiring layers in some embodiments. The IC design layout includes a substrate that has at least one through-silicon via (“TSV”). The method divides the IC design layout into a set of elements. The method identifies a temperature distribution for the IC design layout by using the set of elements. In some embodiments, at least one element includes a metal component and a non-metal component. The non-metal component is silicon in some embodiments, and a dielectric in other embodiments.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distribution show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC design layout into a set of elements, where at least one element includes several wires. The method computes a set of conductivity groups of values for the set of elements. The method identifies a temperature distribution for the IC design layout based on the set of conductivity groups of values. In some embodiments, each of these elements corresponds to a particular portion of a particular layer of the IC design layout. Each element includes several nodes. Each conductivity group of values is defined by entry values. Each entry value describes how heat flow at a particular node of the element is affected by a temperature change at another particular node of the element.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout. The IC design layout includes several wiring layers in some embodiments. The IC design layout includes a substrate that has at least one through-silicon via (“TSV”). The method divides the IC design layout into a set of elements. The method identifies a temperature distribution for the IC design layout by using the set of elements. In some embodiments, at least one element includes a metal component and a non-metal component. The non-metal component is silicon in some embodiments, and a dielectric in other embodiments.

Abstract: Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) design layout that includes numerous circuit modules. The method divides the IC design layout into a set of elements, where at least one element includes several wires. The method computes a set of conductivity groups of values for the set of elements. The method identifies a temperature distribution for the IC design layout based on the set of conductivity groups of values. In some embodiments, each of these elements corresponds to a particular portion of a particular layer of the IC design layout. Each element includes several nodes. Each conductivity group of values is defined by entry values. Each entry value describes how heat flow at a particular node of the element is affected by a temperature change at another particular node of the element.