Abstract: An article comprising a substrate and an anti-reflection coating, and methods for depositing the coating, are disclosed. The coating comprises (a) a first coating layer having a high refractive index deposited on the substrate; (b) an epoxide-silica coating layer deposited onto the high refractive index coating layer, comprising an inorganic silica component and an organic organo-silicate component, and (c) a silica coating layer consisting essentially of silica, deposited directly onto the epoxide-silica coating layer. The anti-reflection coating optionally comprises a stack of coating layers, between the first high refractive index coating layer and the epoxide-silica coating layer, having alternating a low refractive index and a high refractive index. Individual coating layer compositions, refractive indexes, and thicknesses are carefully controlled such that reflectance is minimized through destructive interference in the visible light wavelength range of 400 to 700 nm.

Abstract: Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy (meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water.

Abstract: Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy (meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy(meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: An improved abrasion-resistant, antistatic, antireflective transparent coating, and a method for making it, are described. The coating includes a hard coat underlayer and an antistatic, antireflective overlayer, wherein the overlayer consists essentially of hydrolyzed silica and silica particles having a size less than 1000 nm and a concentration in the range of 0.00015 to 0.01 mg/cm2. The antistatic, antireflective overlayer is made using a sol-gel method including steps of (1) preparing a sol-gel solution comprising a hydrolyzed organo-metallic compound of silicon and silica particles, (2) modifying the outer surface of the hard coat layer, (3) depositing the sol-gel solution onto the modified outer surface of the hard coat layer, and (4) thermally treating the article in an atmosphere having a controlled humidity, wherein the partial pressure of the water, PH2O, expressed in units of kPa, satisfies the following inequality: PH2O?0.09+0.05T where T is temperature, in degrees C.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: A process is described for applying a thin-film, hydrophobic, oil-repellant, stain-resistant, optical coating to a transparent substrate. The coating is applied using a treatment solution that incorporates an organosilane in a solvent of water, alcohol, and ethylene glycol or glycerol, and an acid catalyst, with the organosilane having a preferred concentration in the range of 0.05 to 50 mmole per liter. The treatment solution preferably is prepared in a two-step procedure, in which the organosilane is first reacted in concentrated form and then diluted. After the treatment solution has been applied to the transparent substrate, e.g., by dip coating, the coated substrate is dried, preferably by flash-drying at room temperature and then heating it to a prescribed elevated temperature, in a prescribed humidity.

Abstract: A coated transparency, and method for making it, is disclosed, the transparency having a multi-layer antireflection coating that provides high transmittance with low specular reflectance, yet that also provides reduced visibility of surface defects. The coating includes alternating layers of polymerized silicon dioxide and polymerized titanium dioxide on a transparent substrate, with at least one of the layers incorporating discrete particles having a refractive index different from that of surrounding polymer. This provides the coating with a diffuse reflectance that is comparable to, or larger than, its specular reflectance, yet that still is negligible when compared to the coating's transmittance. The diffuse reflectance creates a loss of contrast for any reflected image or glare, thus masking any surface defects and providing a comfortable visual appearance.

Abstract: A sol-gel process is disclosed for depositing multi-layer antireflection coatings on plastic substrates. One or more polymerized, titanium-containing solutions are provided by mixing a titanium alkoxide, an alcohol, and water, and one or more polymerized, silicon-containing solutions are provided by mixing a silicon alkoxide, an alcohol, and water. These solutions are applied to the plastic substrate in an alternating fashion, to produce a succession of uniform layers of polymerized titanium dioxide and polymerized silicon dioxide. Each layer is individually cured before the next layer is applied. The resulting coating of multiple polymerized layers provides very low reflectance over the entire visible wavelength range, yet with excellent mechanical strength and durability.