Patents by Inventor Yongbing DAI

Yongbing DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230314349
    Abstract: A multi-physical field measurement device for a metal solidification process and a housing and a measurement method thereof are provided. The device includes: a sealed housing provided with a light-through hole; a heater provided inside the housing and located behind the light-through hole along an X-ray; a diffraction detector used for receiving the X-ray which penetrates through a sample sheet and is scattered; a CMOS camera located behind the heater along the X-ray (11) and used for receiving a visible light signal which penetrates through the sample sheet; a silicon drift X-ray detector located at one side of the X-ray and used for receiving a fluorescent signal sent by interaction between the X-ray and the sample piece sheet; and an infrared thermal imager located at the other side of the X-ray and used for receiving an infrared signal sent by the sample sheet.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 5, 2023
    Inventors: Jiao ZHANG, Yang TANG, Ya ZHANG, Yue WU, Hui XING, Baode SUN, Yanfeng HAN, Yongbing DAI, Chaopeng FU, Qing DONG