Abstract: The present application provides a container and a container data center. The container includes a box, a heat dissipation pipeline, a coil component, a supply component, and an extraction component. The box has an accommodating cavity, and the heat dissipation pipeline, the coil component, the supply component and the extraction component are all located outside the box. The heat dissipation pipeline has an air inlet end and an air outlet end. Two ends of the coil component are respectively connected to the supply component and the extraction component. A cooling medium for cooling high-temperature gas flows inside the coil component and is used to cool the high-temperature gas entering the heat dissipation pipeline from the accommodating cavity. The cooling medium becomes a defective medium after contacting and exchanging heat with the high-temperature gas, and the extraction component is configured to discharge the defective medium.

Abstract: The present application provides a container and a data center of the container. A box is provided with an accommodating cavity for placing an electronic device, and a heat dissipation pipeline includes a housing with a cooling cavity, where the cooling cavity is filled with cooling liquid, and high-temperature gas in the accommodating cavity enters the cooling cavity through an inlet, and low-temperature gas in the cooling cavity generated after heat exchange with the cooling liquid enters the accommodating cavity through an outlet for cooling the electronic device to form heat dissipation circulation.

Abstract: The present disclosure relates to a chassis, an electronic apparatus and a chassis exhaust method. The chassis includes: a housing, forming an accommodating cavity, where the accommodating cavity is configured for accommodating cooling liquid and a heating component immersed in the cooling liquid; a condenser, disposed in the accommodating cavity and configured for condensing the cooling liquid in a gas phase; a cooling liquid interface, disposed on the housing; and an exhaust component, located on the housing and at least configured for exhausting gas in the accommodating cavity when the cooling liquid is injected into the accommodating cavity through the cooling liquid interface.

Abstract: A cooling apparatus and an electronic device, where, the cooling apparatus includes: a condensing part and a sealing part, where the sealing part can accommodate a cooling liquid, and a circuit board mounted with a heat-producing element can be immersed in the cooling liquid; and the condensing part includes a condensing tube and an air cooling structure used for dissipating heat of the condensing tube, the condensing tube is connected with the sealing part, and the air cooling structure is provided on at least one side of the condensing tube.

Abstract: The present disclosure relates to a chip module, a circuit board and an electronic device. The chip module includes: a chip; a heat-dissipating metal sheet, and a thermal conductive layer located between the chip and the heat-dissipating metal sheet, where a thermal conductive material included in the thermal conductive layer is a phase change material or a thermal conductive paste.

Abstract: The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.