Patents by Inventor Yongchang Lim

Yongchang Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi layer for encapsulation comprising a planarizing organic thin layer and a conformal organic thin layer
    Patent number: 9681501
    Abstract: A multi layer encapsulating film includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in order of (a) a planarizing organic thin film, an inorganic thin film, a conformal organic thin film, and an inorganic thin film, (b) a conformal organic thin film, an inorganic thin film, a planarizing organic thin film, and an inorganic thin film, (c) a planarizing organic thin film, a conformal organic thin film, and an inorganic thin film, or (d) a conformal organic thin film, a planarizing organic thin film, and an inorganic thin film. The multi layer encapsulating film according to the invention can improve the surface roughness by using the planarizing organic thin film, and can enable particles to uniformly cover the device by using the conformal organic thin film.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: June 13, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Sangcheol Nam, Hoyoung Park, Yongchang Lim, Kichang Lee, Kyugil Choi, Hosung Hwang, Giback Park, Jimin Kim
  • MULTI LAYER FOR ENCAPSULATION COMPRISING A PLANARIZING ORGANIC THIN LAYER AND A CONFORMAL ORGANIC THIN LAYER
    Publication number: 20100272945
    Abstract: A multi layer encapsulated film includes at least one planarizing organic thin film, at least one conformal organic thin film, and at least one inorganic thin film. The thin films are laminated in order of (a) a planarizing organic thin film, an inorganic thin film, a conformal organic thin film, and an inorganic thin film, (b) a conformal organic thin film, an inorganic thin film, a planarizing organic thin film, and an inorganic thin film, (c) a planarizing organic thin film, a conformal organic thin film, and an inorganic thin film, or (d) a conformal organic thin film, a planarizing organic thin film, and an inorganic thin film. The multi layer encapsulated film according to the invention can improve the surface roughness by using the planarizing organic thin film, and can enable particles to uniformly cover the device by using the conformal organic thin film.
    Type: Application
    Filed: April 3, 2008
    Publication date: October 28, 2010
    Applicant: GSNANOTECH CO., LTD.
    Inventors: Sangcheol Nam, Hoyoung Park, Yongchang Lim, Kichang Lee, Kyugil Choi, Hosung Hwang, Giback Park, Jimin Kim