Patents by Inventor YONGCHANG ZHOU

YONGCHANG ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder alloy, solder and method for producing same
    Patent number: 10766103
    Abstract: The present invention discloses a solder alloy, solder and a method for producing the same, and belongs to the field of solder. The solder alloy contains 0.9-4.1 wt % of silver, 0.3-1 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. After the solder formed by the solder alloy of the present invention is subjected to multiple reflows and tested by a ball shear test, the residual tin in the solder joint could reach at least 95%, which meets the ball shear standards required by AEC-Q100.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: September 8, 2020
    Assignee: SHANGHAI PHICHEM MATERIAL CO., LTD.
    Inventor: Yongchang Zhou
  • SOLDER ALLOY, SOLDER AND METHOD FOR PRODUCING SAME
    Publication number: 20190270168
    Abstract: The present invention discloses a solder alloy, solder and a method for producing the same, and belongs to the field of solder. The solder alloy contains 0.9-4.1 wt % of silver, 0.3-1 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. After the solder formed by the solder alloy of the present invention is subjected to multiple reflows and tested by a ball shear test, the residual tin in the solder joint could reach at least 95%, which meets the ball shear standards required by AEC-Q100.
    Type: Application
    Filed: February 4, 2019
    Publication date: September 5, 2019
    Applicant: SHANGHAI PHICHEM MATERIAL CO., LTD.
    Inventor: YONGCHANG ZHOU