Abstract: Disclosed are basic copper chloride particulate matter and a preparation method therefor. The basic copper chloride particulate matter is mainly composed of basic copper chloride particles, and the basic copper chloride particles, with a particle size of 60-250 ?m, in the basic copper chloride particulate matter comprise 97% or more of the total mass of the basic copper chloride particulate matter.

Abstract: A resource scheduling method, a resource scheduling system, a device, and a computer-readable storage medium are disclosed. The resource scheduling method may include: obtaining a scheduling object from a scheduling queue (S100); and when the scheduling object is a customized resource, splitting the customized resource according to the current resource state to obtain a scheduling unit list (S200), the scheduling unit list including first scheduling units configured to form the customized resource; and sequentially scheduling the first scheduling units in the scheduling unit list (S300).

Abstract: Described herein are methods, uses, and kits for droplet-based single cell sequencing of nucleic acids from extracellular vesicles. Specifically, the disclosure provides methods of analyzing protein compositions from individual extracellular vesicles (EVs) from biological samples including pluralities of EVs, the methods comprising labeling the EVs with antibody-DNA conjugates; encapsulating the labeled EVs, barcoded beads, and an extension reagent mix into droplets; within one or more of the droplets, hybridizing the antibody-DNA conjugates with a hybridization region in the barcoded beads; generating RNA from the DNA; synthesizing cDNA from the RNA; amplifying and sequencing the cDNA from one or more individual EVs from the biological sample; and analyzing the sequence of the cDNA from individual EVs to define their protein composition.

Abstract: A basic zinc chloride particulate matter and a preparation method therefor. The basic zinc chloride particulate matter mainly consists of basic zinc chloride particles. In the basic zinc chloride particulate matter, D10>100 ?m, and D95>450 ?m. The basic zinc chloride particles do not contain adhesives. The basic zinc chloride particles contained in the basic zinc chloride particulate matter are approximately spherical, and the basic zinc chloride particles with the particle diameter>500 ?m in the basic zinc chloride particulate matter accounts for 1% or less of the total mass of the basic zinc chloride particulate matter.

Abstract: Method and system for managing a cloud service cluster are provided.

Abstract: A basic zinc chloride particulate matter and a preparation method therefor. The basic zinc chloride particulate matter mainly consists of basic zinc chloride particles. In the basic zinc chloride particulate matter, D10>100 ?m, and D95>450 ?m. The basic zinc chloride particles do not contain adhesives. The basic zinc chloride particles contained in the basic zinc chloride particulate matter are approximately spherical, and the basic zinc chloride particles with the particle diameter >500 ?m in the basic zinc chloride particulate matter accounts for 1% or less of the total mass of the basic zinc chloride particulate matter.

Abstract: Disclosed are basic copper chloride particulate matter and a preparation method therefor. The basic copper chloride particulate matter is mainly composed of basic copper chloride particles, and the basic copper chloride particles, with a particle size of 60-250 ?m, in the basic copper chloride particulate matter comprise 97% or more of the total mass of the basic copper chloride particulate matter.

Abstract: A method of filling shallow trenches is disclosed. The method includes: successively forming a first oxide layer and a second oxide layer over the surface of a silicon substrate where shallow trenches are formed in; etching the second oxide layer to form inner sidewalls with an etchant which has a high etching selectivity ratio of the second oxide layer to the first oxide layer; growing a high-quality pad oxide layer by thermal oxidation after the inner sidewalls are removed; and filling the trenches with an isolation dielectric material. By using this method, the risk of occurrence of junction spiking and electrical leakage during a subsequent process of forming a metal silicide can be reduced.