Abstract: The present disclosure discloses a dimming mirror and a manufacturing method thereof, and a dimming apparatus. The dimming mirror includes a dimming layer including a plurality of dimming units. Each of the dimming units includes a first driving structure and a second driving structure opposite to each other, and an elastic supporting structure disposed between the first driving structure and the second driving structure. The first and second driving structures and the elastic supporting structure enclose a dimming chamber. The first and second driving structures are configured to adjust a dimming angle of the dimming unit by adjusting a gap width of the dimming chamber, such that a response wavelength of the dimming mirror is adjusted. The present disclosure facilitates the improvement of the flexibility of the dimming mirror.

Abstract: The present disclosure provides an acoustic transducer unit and a manufacturing method thereof, and an acoustic transducer, the acoustic transducer unit includes: a base substrate; a first electrode on the base substrate; a support pattern on a side of the first electrode away from the base substrate, which is enclosed into an accommodation groove, at least one release groove and at least one connection groove, an orthographic projection of the release groove on the base substrate is spaced apart from that of the accommodation groove on the base substrate, the connection groove is between the accommodation groove and the release groove to communicate them; a diaphragm pattern on the side of the first electrode away from the base substrate and capable of vibrating in the accommodation groove; a filling pattern in the release groove; a second electrode on a side of the diaphragm pattern away from the base substrate.

Abstract: A transducer element includes array elements. At least one array element includes a substrate and a first electrode layer, a diaphragm layer, and a second electrode layer that are sequentially stacked thereon. An array element has a working region including working sub-regions, and a peripheral region surrounding the working region; overlapping portions of the first electrode layer, the diaphragm layer and the second electrode layer form cells, and a cell is located in a working sub-region; portions of the diaphragm layer and portions of the first electrode layer that are located in the working sub-regions have cavities therebetween, and the portions of the diaphragm layer are configured to vibrate in a direction perpendicular to the substrate between the first and second electrode layers; two adjacent cavities communicate; the diaphragm layer has release holes located in the peripheral region; and a release hole communicates with at least one cavity.

Abstract: An acoustic transduction unit, a manufacturing method thereof and an acoustic transducer, and relates to the technical field of electronic devices. A first electrode is arranged on a first substrate, a support layer is arranged on a side, close to the first electrode, of the first substrate, and a conductive diaphragm layer is arranged on a side, away from the first substrate, of the support layer; a cavity is enclosed by the support layer, overlapping areas exist between orthographic projections of the first electrode, the conductive diaphragm layer and the cavity on the first substrate, and the conductive diaphragm layer serves as both a diaphragm layer and a second electrode in the acoustic transduction unit, it allows the conductive diaphragm layer to be configured as both the diaphragm layer and the second electrode, a layer structure of the acoustic transduction unit is simple.

Abstract: An embodiment of the present disclosure provides a method for driving an acoustic transducer, including: obtaining a reference electrical signal according to a first electrical signal output by a first acoustic transducer element in a case where sound waves are not received by the first acoustic transducer element; obtaining an actual detected electrical signal according to a second electrical signal output by a second acoustic transducer element in a case where sound waves are received by the second acoustic transducer element; and performing a noise reduction process on the actual detected electrical signal according to the reference electrical signal to obtain a noise-reduced signal as a final output electrical signal of the second acoustic transducer element in a case where sound waves are received by the second acoustic transducer element. An embodiment of the present disclosure further provides an acoustic transducer.

Abstract: The present disclosure provides an acoustic transducer, including: a base substrate and a plurality of acoustic transducer elements located on the base substrate. The acoustic transducer element includes: a switch and an acoustic transducer unit. A first terminal of the switch is electrically connected to a control signal line, and a second terminal of the switch is electrically connected to the acoustic transducer unit located in the same acoustic transducer element as the switch. The switch is configured to control connection and disconnection between the acoustic transducer unit located in the same acoustic transducer element as the switch and the control signal line. An embodiment of the present disclosure further provides a method for manufacturing the acoustic transducer.

Abstract: The present disclosure provides a capacitive micro-machined ultrasonic transducer, a method for preparing the same, a panel, and a device, and belongs to the technical field of ultrasonic imaging. A capacitive micro-machined ultrasonic transducer includes a first electrode, a vibrating diaphragm layer and a second electrode that are arranged in order from bottom to top, a cavity existing between the first electrode and the vibrating diaphragm layer, in which the capacitive micro-machined ultrasonic transducer further includes a third electrode located on a surface of the vibrating diaphragm layer proximate to the cavity, an orthogonal projection of the third electrode on the first electrode covers a part of an orthogonal projection of the cavity on the first electrode. The technical solution of the present disclosure can realize the conversion of the frequency of the ultrasonic waves emitted by the capacitive micro-machined ultrasonic transducer.

Abstract: The present disclosure discloses a dimming mirror and a manufacturing method thereof, and a dimming apparatus. The dimming mirror includes a dimming layer including a plurality of dimming units. Each of the dimming units includes a first driving structure and a second driving structure opposite to each other, and an elastic supporting structure disposed between the first driving structure and the second driving structure. The first and second driving structures and the elastic supporting structure enclose a dimming chamber. The first and second driving structures are configured to adjust a dimming angle of the dimming unit by adjusting a gap width of the dimming chamber, such that a response wavelength of the dimming mirror is adjusted. The present disclosure facilitates the improvement of the flexibility of the dimming mirror.

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).