Abstract: A semiconductor package is disclosed. The semiconductor package comprises: a metal shim, a package substrate attached onto a front side of the metal shim, wherein the package substrate comprises an opening that passes therethough; one or more electronic components mounted on the package substrate; an encapsulant layer partially formed on the package substrate to expose a region of the package substrate and the opening of the package substrate, wherein the encapsulant layer encapsulates the one or more electronic components on the package substrate; a first connector mounted in the exposed region of the package substrate; a second connector mounted in the encapsulant layer and on the package substrate; and a magnet mounted in the opening of the package substrate and extending from the metal shim through the package substrate and the encapsulant layer.