Patents by Inventor YongDong Shi

YongDong Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical contact assembly for printed circuit boards
    Patent number: 9865953
    Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: January 9, 2018
    Assignee: International Business Machines Corporation
    Inventors: Na Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin
  • ELECTRICAL CONTACT ASSEMBLY FOR PRINTED CIRCUIT BOARDS
    Publication number: 20170310031
    Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
    Type: Application
    Filed: July 11, 2017
    Publication date: October 26, 2017
    Inventors: Na Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin
  • Electrical contact assembly for printed circuit boards
    Patent number: 9793634
    Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: October 17, 2017
    Assignee: International Business Machines Corporation
    Inventors: Na Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin
  • ELECTRICAL CONTACT ASSEMBLY FOR PRINTED CIRCUIT BOARDS
    Publication number: 20170256875
    Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 7, 2017
    Inventors: Na Fan, Jun Hu, Sen Xiong Huang, YongDong Shi, XiYuan Yin