Abstract: The present disclosure provides a processing chamber applied to semiconductor processing equipment, including a transfer chamber and a plurality of reaction chambers above the transfer chamber. The plurality of reaction chambers are all communicatively connected to the transfer chamber through bottom openings. A plurality of bases can ascend and descend between the reaction chambers and the transfer chamber. The processing chamber further includes a transfer mechanism and a carrier mechanism arranged in the transfer chamber. The transfer mechanism is configured to transfer wafers from outside the processing chamber to the carrier mechanism or onto the plurality of bases, and to transfer the wafers on the plurality of bases out of the processing chamber. The carrier mechanism is configured to carry the plurality of wafers and can transfer the plurality of wafers carried by the carrier mechanism onto the plurality of bases.

Abstract: A semiconductor process chamber includes: a reaction chamber; a transfer chamber below the reaction chamber connected to the transfer chamber through a bottom opening; a base with a lifting shaft connected to a bottom of the base, where the base is able to rise and descend between the reaction chamber and the transfer chamber through the bottom opening; and an elastic annular sealing structure. The annular sealing structure is below the base and surrounding the lifting shaft of the base. When the base descends into the transfer chamber, the base presses down and compress the annular sealing structure; and when the base rises into the reaction chamber and pressure on the annular sealing structure is released, the annular sealing structure stretches until it abuts a bottom wall of the reaction chamber. to seal the bottom opening.

Abstract: A semiconductor processing apparatus includes a process chamber, a gas intake device, a base, and a flow guide structure. The process chamber includes a process area and a transfer area arranged from top to bottom, the gas intake device is disposed at a top of the process chamber for introducing a process gas into the process area. The base is vertically movable and is disposed in the transfer area for carrying a wafer. The flow guide structure is connected to a gas supply source, and fixedly attached to the base; and when the base is located at a process position, the flow guide structure is configured to blow a gas outward to an outer peripheral surface. An exhaust structure is disposed at the sidewall of the process chamber and is configured to discharge the gas blown out of the flow guide structure when the base is located at the process position.

Abstract: A powder-enhanced friction stir rivet welding device includes a friction stir rivet welding spindle, a C-shaped frame and a tooling platform. The friction stir rivet welding spindle includes a rotating mechanism, a feed mechanism, a vibration-rotation mixing mechanism and a powder feeding mechanism. The friction stir rivet welding spindle is configured to realize rotation and feed movements of a rivet and feeding and mixing of a powder. The C-shaped frame is configured to fix the friction stir rivet welding spindle and the tooling platform. The tooling platform includes a force sensor, a sensor indenter, a tooling mould and a tooling platen. The tooling platform is configured to clamp a workpiece to be riveted and welded, and measure a rivet welding force of the friction stir rivet welding spindle in real time.

Abstract: A powder-enhanced friction stir rivet welding device includes a friction stir rivet welding spindle, a C-shaped frame and a tooling platform. The friction stir rivet welding spindle includes a rotating mechanism, a feed mechanism, a vibration-rotation mixing mechanism and a powder feeding mechanism. The friction stir rivet welding spindle is configured to realize rotation and feed movements of a rivet and feeding and mixing of a powder. The C-shaped frame is configured to fix the friction stir rivet welding spindle and the tooling platform. The tooling platform includes a force sensor, a sensor indenter, a tooling mould and a tooling platen. The tooling platform is configured to clamp a workpiece to be riveted and welded, and measure a rivet welding force of the friction stir rivet welding spindle in real time.