Patents by Inventor Yong Fu Wu

Yong Fu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for electroplating metal wire
    Patent number: 7736483
    Abstract: A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: June 15, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Yau Huang, Cheng-Chung Chen, Yong-Fu Wu, Cheng-Hung Tsai, Chwan-Gwo Chyau, Fang-Tsun Chu
  • Enhancement of the wetting of hydrophobic surfaces by aqueous surfactant solutions
    Patent number: 7264885
    Abstract: A solid hydrophobic surface wetted with an aqueous solution that includes a first and second surfactant. The first surfactant includes a first straight-chain, branched chain or cyclic hydrocarbon chain and a first hydrophilic moiety. The second surfactant includes a second straight-chain, branched chain or cyclic hydrocarbon chain and a second hydrophilic moiety. The first and second straight-chain, branched chain or cyclic hydrocarbon chains may or may not be the same; the first and second hydrophilic moieties are not the same; and the first surfactant is added to the second surfactant in an amount that causes a synergistic increase in the spreading factor on the hydrophobic surface.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: September 4, 2007
    Assignee: Research Foundation of the City University of New York
    Inventors: Milton J. Rosen, Yong Fu Wu
  • Method for electroplating metal wire
    Publication number: 20070131557
    Abstract: A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).
    Type: Application
    Filed: January 19, 2007
    Publication date: June 14, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Yau Huang, Cheng-Chung Chen, Yong-Fu Wu, Cheng-Hung Tsai, Chwan-Gwo Chyau, Fang-Tsun Chu
  • Method for electroplating metal wire
    Publication number: 20040129572
    Abstract: A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).
    Type: Application
    Filed: August 8, 2003
    Publication date: July 8, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Yau Huang, Cheng-Chung Chen, Yong-Fu Wu, Cheng-Hung Tsai, Chwan-Gwo Chyau, Fang-Tsun Chu
  • Enhancement of the wetting of hydrophobic surfaces by aqueous surfactant solutions
    Publication number: 20040030024
    Abstract: A solid hydrophobic surface wetted with an aqueous solution that includes a first and second surfactant. The first surfactant includes a first straight-chain, branched chain or cyclic hydrocarbon chain and a first hydrophilic moiety. The second surfactant includes a second straight-chain, branched chain or cyclic hydrocarbon chain and a second hydrophilic moiety. The first and second straight-chain, branched chain or cyclic hydrocarbon chains may or may not be the same; the first and second hydrophilic moieties are not the same; and the first surfactant is added to the second surfactant in an amount that causes a synergistic increase in the spreading factor on the hydrophobic surface.
    Type: Application
    Filed: March 10, 2003
    Publication date: February 12, 2004
    Inventors: Milton J. Rosen, Yong Fu Wu