Patents by Inventor Yonggang Huang

Yonggang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS
    Publication number: 20080157235
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Application
    Filed: September 6, 2007
    Publication date: July 3, 2008
    Inventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang
  • Techniques for analyzing non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects
    Patent number: 7363173
    Abstract: Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: April 22, 2008
    Assignee: California Institute of Technology
    Inventors: Ares J. Rosakis, Yonggang Huang
  • Characterizing Curvatures and Stresses in Thin-Film Structures on Substrates having Spatially Non-Uniform Variations
    Publication number: 20070180919
    Abstract: Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
    Type: Application
    Filed: December 6, 2006
    Publication date: August 9, 2007
    Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Ares Rosakis, Yonggang Huang
  • Techniques and devices for characterizing spatially non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects
    Publication number: 20060276977
    Abstract: Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location. Techniques and devices for determining a misfit strain between a film and a substrate on which the film is deposited are also described.
    Type: Application
    Filed: May 10, 2006
    Publication date: December 7, 2006
    Inventors: Ares Rosakis, Yonggang Huang
  • Techniques for analyzing non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects
    Publication number: 20050278126
    Abstract: Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
    Type: Application
    Filed: March 14, 2005
    Publication date: December 15, 2005
    Inventors: Ares Rosakis, Yonggang Huang