Patents by Inventor Yong Gang Jin

Yong Gang Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Torch bump
    Patent number: 6940169
    Abstract: A torch bump is provided, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening through the first layer of dry film, the base aligns with an underlying contact pad. A second dry film is over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched. Reflow is applied to the deposited solder, creating the torch solder bump.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: September 6, 2005
    Assignee: Stats Chippac Ltd.
    Inventors: Yong Gang Jin, Won Sun Shin
  • Torch Bump
    Publication number: 20040178503
    Abstract: A new method and sequence is provided for the creation of solder bumps. The design of the invention implements a torch bump, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is laminated over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening created through the first layer of dry film, the created base aligns with an underlying contact pad. A second dry film is laminated over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched.
    Type: Application
    Filed: March 1, 2004
    Publication date: September 16, 2004
    Applicant: ST Assembly Test Services Pte Ltd
    Inventors: Yong Gang Jin, Won Sun Shin
  • Method of forming a small pitch torch bump for mounting high-performance flip-flop devices
    Patent number: 6740577
    Abstract: A torch bump is provided, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening through the first layer of dry film, the base aligns with an underlying contact pad. A second dry film is over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched. Reflow is applied to the deposited solder, creating the torch solder.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: May 25, 2004
    Assignee: St Assembly Test Services Pte LTD
    Inventors: Yong Gang Jin, Won Sun Shin
  • SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-CHIP
    Publication number: 20030219966
    Abstract: A new method and sequence is provided for the creation of solder bumps. The design of the invention implements a torch bump, which is a solder bump comprising a base over which a solder bump is created. A first layer of dry film is laminated over a supporting surface over which first a layer of UBM has been deposited. A base for the solder bump is created in a first opening created through the first layer of dry film, the created base aligns with an underlying contact pad. A second dry film is laminated over the surface of the first dry film, a second opening is created through the second dry film that aligns with the created base of the solder bump. The opening through the second dry film is filled with solder by solder printing, the first and second layers of dry film are removed, the deposited layer of UBM is etched.
    Type: Application
    Filed: May 21, 2002
    Publication date: November 27, 2003
    Applicant: St Assembly Test Services Pte Ltd
    Inventors: Yong Gang Jin, Won Sun Shin