Patents by Inventor Yonggang ZHENG

Yonggang ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250045488
    Abstract: The present invention belongs to the field of computational mechanics, and provides an adaptive multi-level phase-field method for brittle fracture of elastic materials under thermal shock, thus to provide a new numerical calculation method for efficient fracture study. In the present invention, damage degree of a material is characterized by a phase field, and the multi-level hp-FEM is used as an adaptive strategy to implement dynamic discretization in a process of crack propagation under thermal shock. Compared with previous adaptive phase-field fracture models, the present invention has no hanging nodes, and has simple numerical implementation and high calculation efficiency, which can effectively predict the fracture behavior of a structure. At the same time, three pre-existing crack treatment techniques are developed to initialize the phase field.
    Type: Application
    Filed: October 23, 2024
    Publication date: February 6, 2025
    Inventors: Yonggang ZHENG, Weilong YANG, Weishuai LI, Yisong QIU, Hongfei YE
  • Publication number: 20240213203
    Abstract: The technology of this application relates to a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die can be directly led out through the first conduction structure and the rewiring layer.
    Type: Application
    Filed: March 8, 2024
    Publication date: June 27, 2024
    Inventors: Yonggang ZHENG, Ran JIANG, Zikai TANG, Yanghua LI, Shujun HUANG
  • Publication number: 20200218491
    Abstract: A method and a device of displaying video data are provided. The method includes receiving playing-window filling data sent from a server, determining player information, playing window information and a data channel identifier based on the playing-window filling data, displaying a player interface corresponding to the player information at a client, determining the playing window corresponding to the playing window information based on the player interface, and displaying the video data corresponding to the data channel identifier in the playing window. The technical solutions of the present disclosure ensure that the player interface synchronizes with the playing window for video data, so that the client may correctly display the video data and the user experience may be improved.
    Type: Application
    Filed: May 23, 2018
    Publication date: July 9, 2020
    Inventors: Lei HAO, Yonggang ZHENG