Patents by Inventor Yonggen WANG
Yonggen WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11941553Abstract: The embodiment of the present disclosure discloses a method, an electronic device, and a storage medium for a ship route optimization. The method for the ship route optimization considers a dynamic feature of a multi-functional emergency rescue ship and an interference effect caused by an airflow, uses a movement model with kinematics non-holonomic constraints, such as a ship total cost assessment function to simulate the movement of the ship, and based on a sparrow search algorithm, learns how to apply the algorithm to a route plan of the emergency rescue ship. The method can improve the ship route optimization algorithm, improve an accuracy and practical applicability of a calculated plan. The method can effectively and accurately locate obstacles and hidden reefs, and consider effects of an airflow and a non-holonomic constraint effect, so as to make the route planning of the ship more efficient and intelligent.Type: GrantFiled: July 5, 2023Date of Patent: March 26, 2024Assignees: HEFEI UNIVERSITY OF TECHNOLOGY, ANHUI CONSTRUCTION ENGINEERING TRAFFIC & SHIPPING GROUP CO., LTD.Inventors: Jingyu Yu, Jingfeng Wang, Wei Lin, Yuxue Pu, Yongchao Zhu, Zhenxuan Li, Qiong Zhang, Yuming Zhang, Yonggen Gu, Zheng Qiu
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Publication number: 20240085447Abstract: An inertial measurement unit (IMU) device includes an IMU sensor, a controller, a temperature sensor electrically connected to the controller, a heat source, and a heat conductive member. The controller is configured to, in response to a temperature of the IMU sensor detected by the temperature sensor falling below a threshold temperature, control the heat source to generate heat. The heat conductive member is configured to transfer heat from the heat source to the IMU sensor, and includes an electrically insulating and thermally conductive material.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Guoxiu PAN, Yonggen WANG, Yun YU, Peng ZHANG
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Publication number: 20240073583Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20240040301Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: February 1, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031723Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031726Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031725Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
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Publication number: 20240031724Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
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Patent number: 11838705Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: GrantFiled: December 2, 2021Date of Patent: December 5, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu
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Patent number: 11821908Abstract: An inertial measurement unit (IMU) device includes a circuit board assembly including a rigid circuit board and a flexible circuit board, an IMU sensor disposed on the rigid circuit board, and a heat preservation system. The IMU sensor is electrically connected to an external element through the flexible circuit board to transmit at least one of a signal or power between the IMU sensor and the external element. The heat preservation system includes a heat source, a heat preservation body with a receiving space to accommodate the IMU sensor, and a heat conductive member configured to transfer heat from the heat source to the IMU sensor to maintain the IMU sensor at a preset temperature. The heat conductive member includes an electrically insulating and thermally conductive silicone.Type: GrantFiled: August 8, 2022Date of Patent: November 21, 2023Assignee: SZ DJI TECHNOLOGY CO., LTD.Inventors: Guoxiu Pan, Yonggen Wang, Yun Yu, Peng Zhang
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Publication number: 20230370763Abstract: One or more embodiments of the present disclosure relate to an earphone, the earphone comprises: a speaker assembly configured to contact with a human head and transmit sound; a function assembly electrically connected to the speaker assembly and configured to control the speaker assembly; and an ear hook connected between the speaker assembly and the function assembly, wherein an attitude or position of the speaker assembly or the function assembly is adjustable with respect to the ear hook.Type: ApplicationFiled: April 26, 2023Publication date: November 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yonggen WANG, Xin QI, Ao JI, Fen YOU
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Publication number: 20230370764Abstract: The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.Type: ApplicationFiled: July 21, 2023Publication date: November 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zhen WANG, Zhiqing LIU, Yonggen WANG, Xinnan MAO
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Patent number: 11736854Abstract: The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.Type: GrantFiled: July 4, 2022Date of Patent: August 22, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhen Wang, Zhiqing Liu, Yonggen Wang, Xinnan Mao
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Publication number: 20230179907Abstract: The present disclosure provides an acoustic apparatus. The acoustic apparatus may include a hook-shaped part, a connecting part, and a holding part. When a user is wearing the acoustic apparatus, the hook-shaped part may be hung between a first side of an ear and a head of the user, the holding part may be in contact with a second side of the ear, and the connecting part may be connected with the hook-shaped part and the holding part. The hook-shaped part may include a first portion and a second portion, the first portion may be connected with the connecting part, and the second portion may be connected with the first portion. A projection of the first portion on a sagittal plane of the user may include a first curve. A projection of the second portion on the sagittal plane of the user may include a second curve.Type: ApplicationFiled: February 2, 2023Publication date: June 8, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Haofeng ZHANG, Jiang XU, Zeying ZHENG, Yonggen WANG, Liwei WANG
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Publication number: 20230082738Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: November 20, 2022Publication date: March 16, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20230028541Abstract: The embodiments of the present disclosure disclose an acoustic apparatus. The acoustic apparatus may include a support assembly. The support assembly may include a first portion and a second portion. When a user is wearing the acoustic apparatus, the first portion may be hung between a first side of an ear and a head of the user, the second portion may contact a second side of the ear. The first portion may cause the second portion to provide a compressive force on the second side of the ear.Type: ApplicationFiled: September 21, 2022Publication date: January 26, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yonggen WANG, Haofeng ZHANG, Zeying ZHENG, Lei ZHANG, Liwei WANG, Jiang XU, Fanyue WANG
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Patent number: D1010626Type: GrantFiled: December 28, 2021Date of Patent: January 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Haofeng Zhang, Zeying Zheng, Sunjie Huang, Yonggen Wang, Jiang Xu, Xinnan Mao
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Patent number: D1010627Type: GrantFiled: December 28, 2021Date of Patent: January 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Haofeng Zhang, Zeying Zheng, Sunjie Huang, Yonggen Wang, Jiang Xu, Xinnan Mao
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Patent number: D1011316Type: GrantFiled: December 28, 2021Date of Patent: January 16, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Haofeng Zhang, Zeying Zheng, Sunjie Huang, Yonggen Wang, Jiang Xu, Xinnan Mao
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Patent number: D1012904Type: GrantFiled: December 28, 2021Date of Patent: January 30, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Haofeng Zhang, Zeying Zheng, Sunjie Huang, Yonggen Wang, Jiang Xu, Xinnan Mao