Patents by Inventor Yonggoo EOM

Yonggoo EOM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240321824
    Abstract: Circuits and devices for a motor driver are described. A hybrid integrated circuit (IC) can include a driver IC, a first IC, and a plurality of second ICs. The first IC can include a plurality of high-side metal-oxide-semiconductor field-effect transistors (MOSFETs). The first IC can further include a common drain terminal connected to drains of the plurality of high-side MOSFETs. Each one of the plurality of second ICs can include a respective low-side MOSFET. The hybrid IC can further include a first set of bonding wires connecting the driver IC to the first IC. The hybrid IC can further include a second set of bonding wires connecting the driver IC to the plurality of second ICs. The hybrid IC can further include a third set of bonding wires connecting the first IC to the plurality of second ICs.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Applicant: Renesas Electronics America Inc.
    Inventors: Tetsuo SATO, Jianghong DING, Yonggoo EOM
  • Publication number: 20240080977
    Abstract: According to an example, a structure is generally described. The structure may include an inductor core having a plurality of surfaces; and at least one conductor integrated with at least one surface of the plurality of surfaces of the inductor core.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 7, 2024
    Applicant: Renesas Electronics America Inc.
    Inventors: Zhizheng LIU, Haiyu ZHANG, Sri Ganesh A THARUMALINGAM, Mark Alan KWOKA, Yonggoo EOM