Abstract: The present invention relates to a microfluidic chip for sorting living cells. A sample flow channel communicates with a liquid inlet end of a sorting flow channel. A gas inlet flow channel, a target flow channel and a non-target flow channel communicate with a liquid outlet end of the sorting flow channel. An included angle between the target flow channel and the sorting flow channel is from 100° to 130°, and an included angle between the non-target flow channel and the sorting flow channel is from 100° to 140°. A distance between an intersection of an axis of the gas inlet flow channel and an axis of the sorting flow channel and an intersection of the sorting flow channel, the target flow channel and the non-target flow channel is from 0.02 mm to 0.05 mm.

Abstract: A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI?500V), high heat resistance (Tg?150° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

Abstract: A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI?500V), high heat resistance(Tg?150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.