Patents by Inventor Yonghang Fu

Yonghang Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230393220
    Abstract: A multilayer ceramic capacitor (MLCC) tester includes a power supply source and a station. The station can include at least one test head having a first contact and a second contact arranged and configured to simultaneously electrically connect to a common MLCC transported to a test site, and arc suppression source circuitry. The arc suppression source circuitry can be electrically connected between an output of the power supply source and the first contact, wherein the arc suppression source circuitry is configured to introduce an impedance to the electrical connection between the MLCC and the power supply source.
    Type: Application
    Filed: September 23, 2021
    Publication date: December 7, 2023
    Applicant: Electro Scientific Industries, Inc
    Inventors: Yonghang FU, Gene MIRRO, Juan HINOJOS, Aaron HUMPHREY, Kyle BALL, Jonathan DANDY, Gale STRANEY, Greg ERWIN
  • Patent number: 7539583
    Abstract: A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the surface is illuminated with light of a plurality of wavelengths, each strobed at a predetermined rate so that multiple images may be collected using time and frequency multiplexing. The multiple images are stored in a database for analysis, which includes processing selected ones of the multiple images according to one or more algorithms. The defect-detection algorithms used for each object are determined by referenced to a predetermined or calculated defect detection protocol, then a defect mask is created for each pixel in the images that is suspected to be defective. The defect mask is then compared to threshold parameters to determine which if any of the suspected defects should be reported.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: May 26, 2009
    Assignee: Rudolph Technologies, Inc.
    Inventors: Yonghang Fu, Yongqiang Liu, Michael J. Darwin
  • Publication number: 20060199287
    Abstract: A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the surface is illuminated with light of a plurality of wavelengths, each strobed at a predetermined rate so that multiple images may be collected using time and frequency multiplexing. The multiple images are stored in a database for analysis, which includes processing selected ones of the multiple images according to one or more algorithms. The defect-detection algorithms used for each object are determined by referenced to a predetermined or calculated defect detection protocol, then a defect mask is created for each pixel in the images that is suspected to be defective. The defect mask is then compared to threshold parameters to determine which if any of the suspected defects should be reported.
    Type: Application
    Filed: August 10, 2005
    Publication date: September 7, 2006
    Inventors: Yonghang Fu, Yongqiang Liu, Michael Darwin
  • Patent number: 6864971
    Abstract: A system and method for performing optical inspection of structures on the surface of a semiconductor wafer. The wafer surface is illuminated with a polychromatic light source. A multiple-charged couple-device (CCD) camera is positioned to capture light diffracted by the structures on the wafer surface at the first order of diffraction. The captured light is then separated into a plurality of component wavelengths which are directed onto the CCDs. A digital filter creates a plurality of digitized diffractive images of the wafer surface at different component wavelengths. The diffractive images may be integrated and analyzed to detect defects in the structures, or may be, analyzed individually. An image at a particular wavelength may be selected and analyzed by using the known grating pitch of the structures to calculate the wavelength.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: March 8, 2005
    Assignee: ISOA, Inc.
    Inventors: YouLing Lin, A. Kathleen Hennessey, Yongqiang Liu, Yonghang Fu, Masami Yamashita, Ichiro Shimomura
  • Patent number: 6813376
    Abstract: A method of collating and using captured semiconductor-wafer image data in an automated defect analysis. The method includes the steps of receiving image data and, if necessary, converting it to a digital format. Once the data is in pixel-by-pixel form, each pixel is assigned a slope value derived from the direction of the structure edge, if any, on which it lies. The pixel-slope data is then evaluated to determine whether a photo-resist anomaly is present. The method may also include evaluated an average pixel slope value for each inspected wafer. Dependant claims further define the invention to claim an inspection system for employing the method.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: November 2, 2004
    Assignee: Rudolph Technologies, Inc.
    Inventors: Kathleen Hennessey, Youling Lin, Yongqiang Liu, Veera V. S. Khaja, Yonghang Fu
  • Publication number: 20020140930
    Abstract: A system and method for performing optical inspection of structures on the surface of a semiconductor wafer. The wafer surface is illuminated with a polychromatic light source. A multiple-charged couple-device (CCD) camera is positioned to capture light diffracted by the structures on the wafer surface at the first order of diffraction. The captured light is then separated into a plurality of component wavelengths which are directed onto the CCDs. A digital filter creates a plurality of digitized diffractive images of the wafer surface at different component wavelengths. The diffractive images may be integrated and analyzed to detect defects in the structures, or may be analyzed individually. An image at a particular wavelength may be selected and analyzed by using the known grating pitch of the structures to calculate the wavelength.
    Type: Application
    Filed: March 8, 2002
    Publication date: October 3, 2002
    Inventors: YouLin Lin, A. Kathleen Hennessey, Yongqiang Liu, Yonghang Fu, Masami Yamashita, Ichiro Shimomura