Patents by Inventor Yong Hee JEONG

Yong Hee JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250042221
    Abstract: A cooling apparatus may include an electric water pump to pump coolant, a coolant channel in fluid communication with a cooling target and the electric water pump, and a thermoelectric device including a higher-temperature part and a lower-temperature part. The thermoelectric device may cool the coolant flowing into the coolant channel. The cooling apparatus may include a first heat sink disposed adjacent to the higher-temperature part, a second heat sink disposed adjacent to the coolant channel, and a cooling fan provided adjacent to the first heat sink. The cooling apparatus may include an air duct forming a first fluid line where air passes through only the first heat sink and is then discharged by operation of the cooling fan and forming a second fluid line where air passes through the first heat sink and the second heat sink and is then discharged by the operation of the cooling fan.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 6, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Tae Hee Kim, Wan Je Cho, Seong-Bin Jeong, Hyunjae Lee, Minseob Shin, Yong Woong Cha, Jae-Eun Jeong
  • Publication number: 20180337307
    Abstract: A semiconductor light emitting device includes a Group-III nitride semiconductor layer on a buffer layer. The buffer layer includes a first layer, a second layer, and a third layer in that order. Each of the first layer, the second layer, and the third layer includes a composition which includes aluminum (Al), nitrogen (N), and oxygen (O). A minimum or average value of an oxygen concentration (atoms/cm3) of each of the first layer and the third layer is greater than an oxygen concentration (atoms/cm3) of the second layer.
    Type: Application
    Filed: December 14, 2017
    Publication date: November 22, 2018
    Inventors: Jung Taek HAN, Jong Sun MAENG, Jeen Seok CHO, Sun Woon KIM, Yong Hee JEONG