Patents by Inventor Yonghui Gao

Yonghui Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250114964
    Abstract: Disclosed is a splicing method for seamless butted laminated bamboo lumber (LBL), falling within the technical field of LBL. According to the present disclosure, positions needing to be spliced on end faces of bamboo materials are applied with glue adhesive, and butted by tenon-mortise structures, the tenon-mortise structure being at least one of a semicircle, a semi-ellipse, a V-shape and a U-shape. An included angle between a plane at a top of the V-shape and the end face of the bamboo material is greater than 14° when a single V-shape is adopted. According to the present disclosure, by butting the bamboo materials, products with any length, width and thickness can be produced, and the produced products are seamless, which improves the strength and stability of the products.
    Type: Application
    Filed: November 6, 2023
    Publication date: April 10, 2025
    Inventors: Yonghui Gao, Shiqing Gao
  • Patent number: 11201134
    Abstract: A method of manufacturing a semiconductor device includes the following steps. A device wafer having a product-obtaining part and an edge part surrounding the product-obtaining part is provided. A passivation layer is formed to cover the device wafer. A first oxide cap layer is formed to cover the passivation layer. An edge trimming process is performed to polish an edge part of the first oxide cap layer, an edge part of the passivation layer and the edge part of the device wafer. A removing process is performed to remove the first oxide cap layer after the edge trimming process is performed. A second oxide cap layer is formed to cover the first oxide cap layer and the edge part of the device wafer.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: December 14, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yonghui Gao, Yi Liu, Guohai Zhang
  • Publication number: 20210327849
    Abstract: A method of manufacturing a semiconductor device includes the following steps. A device wafer having a product-obtaining part and an edge part surrounding the product-obtaining part is provided. A passivation layer is formed to cover the device wafer. A first oxide cap layer is formed to cover the passivation layer. An edge trimming process is performed to polish an edge part of the first oxide cap layer, an edge part of the passivation layer and the edge part of the device wafer. A removing process is performed to remove the first oxide cap layer after the edge trimming process is performed. A second oxide cap layer is formed to cover the first oxide cap layer and the edge part of the device wafer.
    Type: Application
    Filed: April 20, 2020
    Publication date: October 21, 2021
    Inventors: YONGHUI GAO, YI LIU, GUOHAI ZHANG
  • Patent number: 8268431
    Abstract: An apparently seamless lengthened bamboo sheet is formed by lengthening a plurality of bamboo strips or blanks and assembling a plurality of lengthened bamboo strips or blanks together. A slot is formed on at least one end of the bamboo strips or blanks in direction of length, and a tenon corresponding to the slot is formed on the same end; the tenon on one bamboo strip or blank is embedded into the slot on another bamboo strip or blank. The tenon and slot are mutually matched and the two bamboo strips or blanks are engaged to each other. A method to manufacture is the apparently seamless lengthened bamboo sheet includes: forming a slot and a tenon on the end of bamboo strips or blanks; embedding a tenon at one end of one bamboo strip or blank into a slot on one end of another bamboo strip or blank; assembling and gluing a plurality of lengthened bamboo strips or blanks in direction of width or thickness; forming the bamboo sheet by a common process including pressing.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: September 18, 2012
    Assignee: Shanghai Yunsheng Bamboo and Wood Product Co., Ltd.
    Inventors: Yonghui Gao, Shiqing Gao, Shibin Gao
  • Publication number: 20100151175
    Abstract: An apparently seamless lengthened bamboo sheet is formed by lengthening a plurality of bamboo strips or blanks and assembling a plurality of lengthened bamboo strips or blanks together. A slot is formed on at least one end of the bamboo strips or blanks in direction of length, and a tenon corresponding to the slot is formed on the same end; the tenon on one bamboo strip or blank is embedded into the slot on another bamboo strip or blank. The tenon and slot are mutually matched and the two bamboo strips or blanks are engaged to each other. A method to manufacture is the apparently seamless lengthened bamboo sheet includes: forming a slot and a tenon on the end of bamboo strips or blanks; embedding a tenon at one end of one bamboo strip or blank into a slot on one end of another bamboo strip or blank; assembling and gluing a plurality of lengthened bamboo strips or blanks in direction of width or thickness; forming the bamboo sheet by a common process including pressing.
    Type: Application
    Filed: August 1, 2008
    Publication date: June 17, 2010
    Inventors: Yonghui Gao, Shiqing Gao, Shibin Gao