Patents by Inventor YongHui SU

YongHui SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Central subassembly for a flexible expandable automation device
    Patent number: 8472172
    Abstract: The disclosure relates to a subassembly for an expandable automation device, which includes a housing which accommodates a central processing unit, a voltage supply, an interface for connecting external input and output modules, and internal input and output modules. The subassembly can include three electronic subassemblies which are each arranged on a separate carrier, a third carrier being arranged between a first carrier and a second carrier. The first carrier can be configured to accommodate the electronic subassembly of the central processing unit, the second carrier can be configured to accommodate the electronic subassembly of the internal input and output modules, and the third carrier can be configured to accommodate the electronic subassembly of the voltage supply and the interface for connecting external input and output modules.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: June 25, 2013
    Assignee: ABB AG
    Inventors: Gernot Gaub, Gerd Gloeckner, Andreas Wilmers, Deqiang Yang, YongHui Su, YiLing Wang, YiQing Chen
  • CENTRAL SUBASSEMBLY FOR A FLEXIBLE EXPANDABLE AUTOMATION DEVICE
    Publication number: 20100134967
    Abstract: The disclosure relates to a subassembly for an expandable automation device, which includes a housing which accommodates a central processing unit, a voltage supply, an interface for connecting external input and output modules, and internal input and output modules. The subassembly can include three electronic subassemblies which are each arranged on a separate carrier, a third carrier being arranged between a first carrier and a second carrier. The first carrier can be configured to accommodate the electronic subassembly of the central processing unit, the second carrier can be configured to accommodate the electronic subassembly of the internal input and output modules, and the third carrier can be configured to accommodate the electronic subassembly of the voltage supply and the interface for connecting external input and output modules.
    Type: Application
    Filed: November 17, 2009
    Publication date: June 3, 2010
    Applicant: ABB AG
    Inventors: Gernot GAUB, Gerd GLOECKNER, Andreas WILMERS, Deqiang YANG, YongHui SU, YiLing WANG, YIQing CHEN