Patents by Inventor YONGHUI YANG
YONGHUI YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12457787Abstract: The disclosure provides a power semiconductor device and manufacturing method thereof. A plurality of second resistive field plate structures extending through an epitaxial layer in a first direction into a substrate are arranged in a termination region of the epitaxial layer and the plurality of second resistive field plate structures are arranged radially in a first plane. A plurality of tightly coupled second resistive field plates extending from a side close to a cell region to a side far away from the cell region form a more uniform three-dimensional electric field distribution diverging around the cell region, which optimizes a guiding and binding effect on a charge in a space depletion region of the cell region and improves a withstand voltage performance of the whole power semiconductor device.Type: GrantFiled: January 21, 2022Date of Patent: October 28, 2025Assignee: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.24 RESEARCH INSTITUTEInventors: Kaizhou Tan, Tian Xiao, Jiahao Zhang, Yonghui Yang, Hequan Jiang, Ruzhang Li, Peijian Zhang, Yi Zhong, Peng Wang, Yuxin Wang, Xiaojun Fu, Zhaohuan Tang
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Patent number: 12453157Abstract: The MOS device with resistive field plate for realizing conductance modulation field effect in the present invention is based on the existing trench gate MOS device, and a semi-insulating resistive field plate electrically connected to the trench gate structure and the drain structure is added in the drift region, where the trench gate structure can control the on-off of the MOS channel, and the semi-insulating resistive field plate can adjust the doping concentration of the drift region to modulate the conductance of the on-state drift region and the distribution of off-state high-voltage blocking electric field, thus a lower on-resistance can be obtained. In addition, the modern 2.5-dimensional processing technology based on deep trench etching is adopted in the present invention, which is conducive to the miniaturization design and high density design of the structure and is more suitable for the More than Moore (beyond Moore) development of modern integrated semiconductor devices.Type: GrantFiled: April 26, 2021Date of Patent: October 21, 2025Assignee: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATIONInventors: Kaizhou Tan, Tian Xiao, Jiahao Zhang, Yonghui Yang, Xiaoquan Li, Pengfei Wang, Ying Pei, Guangbo Li, Hequan Jiang, Peijian Zhang, Sheng Qiu, Liang Chen, Wei Cui
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Publication number: 20250284960Abstract: A robust multimedia recommendation method based on information bottleneck, including: a user representation matrix and an item representation matrix are learned based on a deep graph neural model; mutual information between multimedia content and representation information of the multimedia content is minimized based on an information bottleneck theory to compute a first loss function; a user-item interaction matrix is reconstructed based on the user representation matrix and the item representation matrix to compute a second loss function; and the first loss function and the second loss function are combined to perform multi-task learning to update parameters of the deep graph neural model until the deep graph neural model converges. A robust multimedia recommendation device and a robust multimedia recommendation medium are further provided.Type: ApplicationFiled: May 20, 2025Publication date: September 11, 2025Inventors: Le WU, Yonghui YANG, Kun ZHANG, Richang HONG, Meng WANG, Hailin ZHOU, Wenzheng CHENG
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Publication number: 20240250131Abstract: The disclosure provides a power semiconductor device and manufacturing method thereof. A plurality of second resistive field plate structures extending through an epitaxial layer in a first direction into a substrate are arranged in a termination region of the epitaxial layer and the plurality of second resistive field plate structures are arranged radially in a first plane. A plurality of tightly coupled second resistive field plates extending from a side close to a cell region to a side far away from the cell region form a more uniform three-dimensional electric field distribution diverging around the cell region, which optimizes a guiding and binding effect on a charge in a space depletion region of the cell region and improves a withstand voltage performance of the whole power semiconductor device.Type: ApplicationFiled: January 21, 2022Publication date: July 25, 2024Applicant: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.24 RESEARCH INSTITUTEInventors: Kaizhou TAN, Tian XIAO, Jiahao ZHANG, Yonghui YANG, Hequan JIANG, Ruzhang LI, Peijian ZHANG, Yi ZHONG, Peng WANG, Yuxin WANG, Xiaojun FU, Zhaohuan TANG
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Publication number: 20240038853Abstract: The MOS device with resistive field plate for realizing conductance modulation field effect in the present invention is based on the existing trench gate MOS device, and a semi-insulating resistive field plate electrically connected to the trench gate structure and the drain structure is added in the drift region, where the trench gate structure can control the on-off of the MOS channel, and the semi-insulating resistive field plate can adjust the doping concentration of the drift region to modulate the conductance of the on-state drift region and the distribution of off-state high-voltage blocking electric field, thus a lower on-resistance can be obtained. In addition, the modern 2.5-dimensional processing technology based on deep trench etching is adopted in the present invention, which is conducive to the miniaturization design and high density design of the structure and is more suitable for the More than Moore (beyond Moore) development of modern integrated semiconductor devices.Type: ApplicationFiled: April 26, 2021Publication date: February 1, 2024Applicant: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATIONInventors: Kaizhou TAN, Tian XIAO, Jiahao ZHANG, Yonghui YANG, Xiaoquan LI, Pengfei WANG, Ying PEI, Guangbo LI, Hequan JIANG, Peijian ZHANG, Sheng QIU, Liang CHEN, Wei CUI
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Publication number: 20230411464Abstract: A shared-dielectric MOSFET device with a resistive-field-plate and a preparation method are provided. In the shared-dielectric MOSFET device, the semi-insulating resistive-field-plate electrically connected to the trench gate structure and the drain structure is introduced in the drift region of the existing trench gate MOS devices, and when the trench gate structure controls the MOS channel to be turned on or turned off, the semi-insulating resistive-field-plate can adjust the doping concentration of the drift region, to modulate the conductance of the on-state drift region and the distribution of a off-state high-voltage blocking electric field, thereby obtaining a lower on-resistance. Meanwhile, in the preparation method of the present disclosure, the modern 2.Type: ApplicationFiled: November 1, 2021Publication date: December 21, 2023Applicant: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATIONInventors: Kaizhou TAN, Tian XIAO, Jiahao ZHANG, Xiaoquan LI, Pengfei WANG, Ying PEI, Guangbo LI, Yonghui YANG, Hequan JIANG, Peijian ZHANG, Sheng QIU, Liang CHEN, Wei CUI
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Patent number: 10483358Abstract: A semiconductor cell structure and power semiconductor device, wherein, the semiconductor cell structure includes: a highly-doped semiconductor material region, an epitaxial layer, a dielectric insulating layer, a semi-insulating material, and an active device region, a deep groove is further etched on the epitaxial layer, the deep groove vertically extends into the highly-doped semiconductor material region, the dielectric insulating layer is formed on a side wall inside the deep groove, and the deep groove is filled with the semi-insulating material. The cell structure can be applied to the power semiconductor device during actual application, the present invention dramatically reduces the difficulty of the process implementation, relaxes the harsh requirements on charge balance, broadens the tolerant charge mismatch percentage by approximately ten times, and also improves the long-term reliability of normal operation of the device cell at the same time.Type: GrantFiled: April 1, 2016Date of Patent: November 19, 2019Assignee: NO. 24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATIONInventors: Kaizhou Tan, Gangyi Hu, Zhaohuan Tang, Jianan Wang, Yonghui Yang, Yi Zhong, Yang Cao, Yong Liu, Kunfeng Zhu
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Publication number: 20190027563Abstract: A semiconductor cell structure and power semiconductor device, wherein, the semiconductor cell structure includes: a highly-doped semiconductor material region, an epitaxial layer, a dielectric insulating layer, a semi-insulating material, and an active device region, a deep groove is further etched on the epitaxial layer, the deep groove vertically extends into the highly-doped semiconductor material region, the dielectric insulating layer is formed on a side wall inside the deep groove, and the deep groove is filled with the semi-insulating material. The cell structure can be applied to the power semiconductor device during actual application, the present invention dramatically reduces the difficulty of the process implementation, relaxes the harsh requirements on charge balance, broadens the tolerant charge mismatch percentage by approximately ten times, and also improves the long-term reliability of normal operation of the device cell at the same time.Type: ApplicationFiled: April 1, 2016Publication date: January 24, 2019Applicant: No. 24 Research Institute of China Electronics Technology Group CorporationInventors: KAIZHOU TAN, GANGYI HU, ZHAOHUAN TANG, JIANAN WANG, YONGHUI YANG, YI ZHONG, YANG CAO, YONG LIU, KUNFENG ZHU