Patents by Inventor Yonghun JI

Yonghun JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12328811
    Abstract: An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: June 10, 2025
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Wooram Ki, Dongcheol Park, Yonghun Ji, Yongsang Yun
  • Publication number: 20240014543
    Abstract: According to an embodiment of the disclosure, an electronic device may comprise: a housing including a conductive portion, a plurality of non-conductive portions, and a plurality of openings, a plurality of keyboard key caps exposed through the plurality of openings of the housing, an antenna, and a circuit board disposed inside the housing and electrically connected to the antenna. At least one of the plurality of openings may be defined by the conductive portion, the plurality of the non-conductive portions, and the antenna.
    Type: Application
    Filed: July 6, 2023
    Publication date: January 11, 2024
    Inventors: Kwangbok PARK, Jaeho LEE, Yonghun JI
  • Publication number: 20230034551
    Abstract: An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.
    Type: Application
    Filed: March 31, 2022
    Publication date: February 2, 2023
    Inventors: Wooram KI, Dongcheol PARK, Yonghun JI, Yongsang YUN