Patents by Inventor Yongjie Han

Yongjie Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11624753
    Abstract: A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: April 11, 2023
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yu Liu, Liguang Deng, Xiaoliang Fu, Shuqian Dou, Zhiqiang Fan, Ting Tian, Yawen Zhang, Dayong Zhou, Dong Zhang, Youcai Yang, Zhongjun Wang, Yongjie Han
  • Patent number: 11522110
    Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: December 6, 2022
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Ting Tian, Yawen Zhang, Ming Zhai, Dayong Zhou, Jinge Zhao, Pan Guo, Shuqian Dou, Xiaoliang Fu, Zhiqiang Fan, Meijuan An, Liguang Deng, Yongjie Han
  • Patent number: 11112423
    Abstract: The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 7, 2021
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yongjie Han, Shuqian Dou, Xiaoliang Fu, Ting Tian, Dayong Zhou, Zhiqiang Fan, Yawen Zhang, Youcai Yang, Dong Zhang, Zhongjun Wang, Yu Liu
  • Patent number: 10964855
    Abstract: A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 30, 2021
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ting Tian, Shuqian Dou, Xiaoliang Fu, Liguang Deng, Dayong Zhou, Zhiqiang Fan, Yongjie Han, Yawen Zhang, Zhongjun Wang, Dong Zhang, Yu Liu, Zheran Li, Hyungkyu Kim
  • Patent number: 10936844
    Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: March 2, 2021
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Yu Liu, Liguang Deng, Ming Zhai, Xiaoliang Fu, Shuqian Dou, Yawen Zhang, Ting Tian, Zhiqiang Fan, Dayong Zhou, Dong Zhang, Youcai Yang, Yongjie Han
  • Publication number: 20200327295
    Abstract: The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.
    Type: Application
    Filed: July 16, 2018
    Publication date: October 15, 2020
    Applicants: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Yu LIU, Liguang DENG, Ming ZHAI, Xiaoliang FU, Shuqian DOU, Yawen ZHANG, Ting TIAN, Zhiqiang FAN, Dayong ZHOU, Dong ZHANG, Youcai YANG, Yongjie HAN
  • Publication number: 20200313046
    Abstract: A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.
    Type: Application
    Filed: August 28, 2019
    Publication date: October 1, 2020
    Inventors: Ting TIAN, Shuqian DOU, Xiaoliang FU, Liguang DENG, Dayong ZHOU, Zhiqiang FAN, Yongjie HAN, Yawen ZHANG, Zhongjun WANG, Dong ZHANG, Yu LIU, Zheran LI, Hyungkyu KIM
  • Patent number: 10789446
    Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: September 29, 2020
    Assignees: BEIJING BOE TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou, Zhiqiang Fan, Liguang Deng, Youcai Yang, Zhongjun Wang, Dong Zhang, Yongjie Han, Jinge Zhao, Jia Meng, Yanjun Liu, Yu Liu
  • Publication number: 20200141963
    Abstract: A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell.
    Type: Application
    Filed: November 1, 2019
    Publication date: May 7, 2020
    Applicants: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yu LIU, Liguang DENG, Xiaoliang FU, Shuqian DOU, Zhiqiang FAN, Ting TIAN, Yawen ZHANG, Dayong ZHOU, Dong ZHANG, Youcai YANG, Zhongjun WANG, Yongjie HAN
  • Publication number: 20200013935
    Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.
    Type: Application
    Filed: October 17, 2018
    Publication date: January 9, 2020
    Inventors: Ting Tian, Yawen Zhang, Ming Zhai, Dayong Zhou, Jinge Zhao, Pan Guo, Shuqian Dou, Xiaoliang FU, Zhiqiang Fan, Meijuan An, Liguang Deng, Yongjie Han
  • Publication number: 20190391175
    Abstract: The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.
    Type: Application
    Filed: April 23, 2019
    Publication date: December 26, 2019
    Inventors: Yongjie HAN, Shuqian DOU, Xiaoliang FU, Ting TIAN, Dayong ZHOU, Zhiqiang FAN, Yawen ZHANG, Youcai YANG, Dong ZHANG, Zhongjun WANG, Yu LIU
  • Publication number: 20190370520
    Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.
    Type: Application
    Filed: February 21, 2019
    Publication date: December 5, 2019
    Applicants: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou, Zhiqiang Fan, Liguang Deng, Youcai Yang, Zhongjun Wang, Dong Zhang, Yongjie Han, Jinge Zhao, Jia Meng, Yanjun Liu, Yu Liu